RDRAM-based modules provide high memory bandwidth

Edited by the Electronicstalk editorial team May 16, 2002

New Elpida Memory SO-RIMM modules use 800MHz RDRAM devices with 40ns RAS access time and deliver up to 1.6Gbytes/s memory bandwidth ideal for the networking and telecomms markets.

New Elpida Memory SO-RIMM modules use 800MHz RDRAM devices with 40ns RAS access time and deliver up to 1.6Gbytes/s memory bandwidth ideal for the networking and telecomms markets.

Exclusively from Sunrise Electronics, Elpida's line of SO-RIMM modules offer high-performance and high-capacity memory solutions to meet the quality of service (QoS) requirements of gigabit network line-rates.

The SO-RIMM modules are available in three densities: 64, 128 and 256Mbyte, providing variable memory capacity and flexible upgrades to address a wide range of applications.

All of them use 160-pin packaging and offer smaller form factors and a low pin-count, which saves designers valuable board real estate.

The Elpida SO-RIMM modules are just 67.6 x 31.25 mm, compared with the 133.35 x 34.925mm size of most current module designs.

They also feature 72bit ECC (error correction code) capabilities for high availability and data integrity.

Ideal applications for Elpida's SO-RIMM modules include line cards and network switches with speeds as high as 10Gbit/s (OC-192).

"The volume of network data traffic is expanding daily, and the needs of the networking market are growing with it", said Peter Westerdorf, technical marketing and engineering manager for Elpida Memory (Europe).

"Elpida plans to match those demands with a growing line of Networking memory products.

The speed of RDRAM combined with the low pin count of the Rambus design make these modules an excellent choice for the networking system designers today".

Elpida is focusing on communications with this product line, and the current roadmap includes plans to introduce RDRAM devices at the 1066MHz level during the first half of 2003.

The company also expects to sample 288Mbit RDRAM chips using its proven 0.13-micron process technology by the end of this year.