Single-chip Bluetooth improves coexistence

The SiW3500 UltimateBlue IC is a complete single-chip CMOS Bluetooth solution.

The SiW3500 UltimateBlue IC is a complete single-chip CMOS Bluetooth solution.

The SiW3500 helps speed time to market and implements new features found in Bluetooth Specification Version 1.2, including faster connecting times, adaptive frequency hopping (AFH) for improved coexistence of Bluetooth with other 2.4GHz devices, and extended SCO for improved voice transmissions.

The highly integrated circuit combines a direct conversion radio modem with an ARM7TDMI processor core, Bluetooth baseband logic, and complete protocol software in ROM.

The SiW3500 chip is a complete platform that can execute additional upper layer protocol stack and application software functions, including additional complex audio processing algorithms such as noise cancellation without a separate DSP.

"The SiW3500 UltimateBlue chip has been designed to lower our customer's costs and accelerate their time to market", said Steve Brown, Vice President of business development and product marketing for Silicon Wave.

"The innovative on-chip RF matching makes it considerably easier to integrate the SiW3500 into mobile phones by simplifying PCB design and reducing development effort".

Key features of the SiW3500 UltimateBlue single-chip Bluetooth IC include: a direct conversion architecture with outstanding receiver blocking performance optimised for RF hostile environments within mobile phones; the on-chip 50ohm RF matching network requires no external matching component for direct connection to antenna; support for all standard mobile phone reference clock frequencies; a fast hardware-based automatic gain control circuit that dynamically adjusts receiver for optimal performances; an integrated 32bit ARM7TDMI processor core enables an open software development platform facilitating the integration of upper layer stack and profiles; on-chip ROM storage with dynamic software patch capability; and built-in UltimateBlue coexistence technology software reduces interference to 802.11 devices.

A temperature compensation circuit stabilises performance from -40 to +85C, with an extended high-temperature range to +105C available as an option.

The device comes in a 96-pin 6 x 6mm VFBGA package, with bumped die optionally available.

"Increasing battery life and reducing mobile phone size are constant challenges for OEMs", said Michael Yin, Director of Bluetooth Marketing for Silicon Wave.

"The SiW3500 UltimateBlue IC addresses these needs by delivering low power consumption through its innovative architecture, including a unique instant on/off response technique.

Additionally, its small size requires minimal PCB space and the bumped die option enables extremely small Bluetooth modules".

Samples of the SiW3500 UltimateBlue IC will be available exclusively from RF Micro Devices, Silicon Wave's global channel partner for its CMOS single-chip radio processor and stand-alone radio modem Bluetooth solutions.

In May 2003, RF Micro Devices and Silicon Wave entered into a strategic relationship.

Within the strategic relationship, Silicon Wave granted manufacturing licenses to RFMD for its single-chip UltimateBlue ICs and stand-alone CMOS Bluetooth radio modem solutions.

RFMD is responsible for the supply chain of Silicon Wave's CMOS Bluetooth solutions and is the exclusive global channel partner for these products.

Silicon Wave and RF Micro Devices are both Associate Members of the Bluetooth Special Interest Group.

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