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Product category: Communications ICs (Wireless)
News Release from: RF Micro Devices | Subject: SiW3500
Edited by the Electronicstalk Editorial Team on 12 December 2003

Bluetooth chip runs on 0.18 micron RF
CMOS process

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UMC's 0.18 micron RF CMOS process technology is being used to manufacture Silicon Wave's single-chip Bluetooth IC, the SiW3500.

UMC's 0.18 micron RF CMOS process technology is being used to manufacture Silicon Wave's single-chip Bluetooth IC, the SiW3500 The SiW3500, introduced in November, is the newest addition to Silicon Wave's portfolio of single-chip solutions, which includes the SiW3000 and SiW1712 that are in full volume production at UMC and shipping to multiple customers today

Samples of the SiW3500 are slated for availability in January 2004 from RF Micro Devices, Silicon Wave's global channel partner for its CMOS single-chip radio processor and stand-alone radio modem Bluetooth solutions.

"The SiW3500 UltimateBlue IC is designed to deliver superior RF performance while lowering our customer's costs and accelerating their time to market", says Steve Brown, Vice President of Business Development and Product Marketing for Silicon Wave.

"UMC has a proven track-record in manufacturing sophisticated products targeted to the communications market, ensuring a reliable, cost-effective supply of high performance chips to our customers".

Fu Tai Liou, Head of the America Business Group at UMC, comments: "Smooth integration of UMC's RF technologies with Silicon Wave's designs to successfully power their UltimateBlue Bluetooth solution requires design knowledge, co-operation between all development partners and manufacturing expertise.

We are delighted that our close collaboration with Silicon Wave has resulted in this offering, and that our close support and manufacturing expertise were key factors in delivering their product within their target timeframe".

The SiW3500 UltimateBlue Bluetooth IC features a direct conversion architecture that delivers low spurious emissions and excellent RF blocking characteristics, making it the superior choice for RF hostile environments within mobile phones.

Innovative on-chip RF matching makes it considerably easier to integrate the SiW3500 into mobile phones by simplifying PCB design and reducing development effort.

The SiW3500 is a platform that can execute additional upper layer protocol stack and application software functions, including additional complex audio processing algorithms such as noise cancellation without a separate DSP.

The chip is Bluetooth Version 1.2 compliant, including mandatory and optional features such as adaptive frequency hopping (AFH) and extended SCO (eSCO).

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