Product category:
Intellectual Property Cores
News Release from: Synopsys | Subject: DesignWare USB cores
Edited by the Electronicstalk Editorial
Team on 02 September 2004
USB cores extend down to TSMC 90nm
process
The latest additions to the DesignWare portfolio are a USB 2.0 On-The-Go PHY core for TSMC's 90, 130 and 180nm processes as well as an extension of the Hi-Speed USB 2.0 PHY core to the 90nm process.
The latest additions to the DesignWare portfolio are a USB 2.0 On-The-Go PHY core for TSMC's 90, 130 and 180nm processes as well as an extension of the Hi-Speed USB 2.0 PHY core product line to the 90nm process node The DesignWare USB 2.0 OTG PHY is the industry's first 90nm USB OTG PHY core
This article was originally published on Electronicstalk on 19 Apr 2001 at 8.00am (UK)
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The DesignWare USB 2.0 OTG PHY is interoperability tested and jointly certified with Synopsys industry leading digital USB cores, thus providing a complete drop-in solution with lower cost, form factor and risk.
These 90nm product introductions complement Synopsys' certified Hi-Speed USB 2.0 PHYs currently in volume production on TSMC's 180 and 130nm processes.
The new USB PHYs, which are complete physical layer interface cores compliant with the USB 2.0 OTG standard that provide an integrated solution that has been implemented in silicon and tested with Synopsys' leading family of digital USB intellectual property (IP) cores, including the DesignWare Hi-Speed OTG controller, host controller and device controllers.
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The new OTG PHY handles HNP (host negotiation protocol) and SRP (session request protocol), which are the OTG-specific differences between the Hi-Speed 2.0 and the new OTG standard.
Available targeted to TSMC's 180, 130 and 90nm processes, the OTG solution is based on the Synopsys USB 2.0 PHY that is already certified and shipping in volume.
USB OTG is a supplement to the USB 2.0 specification that increases the capability of existing mobile devices and USB peripherals by adding host functionality for connections to USB peripherals.
Many of the new peripherals connected to PCs and laptops are portable devices.
As these portable devices increase in popularity, there is a growing need for them to communicate directly with each other when a PC is not available.
The OTG supplement addresses this need for mobile interconnectivity and defines a way for portable devices, through only one mini-connector, to connect to supported USB products in addition to the PC.
"With the introduction of our USB 2.0 OTG PHY, designers can speed integration and reduce risk when designing a complete digital and mixed-signal OTG solution targeted to TSMC's most popular foundry processes", said Guri Stark, Synopsys' Vice President of Marketing, Solutions Group.
"For designers at the leading edge of system design, our Hi-Speed USB 2.0 PHY and USB 2.0 OTG PHY in TSMC's 90nm process enable them to achieve USB 2.0 connectivity based on our USB-certified PHY architectures proven at 180 and 130nm".
"Our complementary DesignWare USB PHY and digital IP solutions give designers a one-stop shop and help them lower design risk with proven, interoperable solutions".
The DesignWare USB OTG PHYs and Hi-Speed USB 2.0 PHYs are available now for TSMC's 180, 130 and 90nm processes.
These PHYs are also available for porting to additional foundry processes.
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