Collaboration speeds IC verifictaion

Edited by the Electronicstalk editorial team May 14, 2008

Synopsys' XA acceleration technology allows customers to achieve HSPICE accuracy while delivering far higher performance and capacity than existing FastSpice solutions.

A collaboration between Synopsys and STMicroelectronics has enabled ST to significantly accelerate its high-accuracy, transistor-level verification of complex analogue ICs using ST's Smart Power technology for highly integrated automotive applications.

"Our Smart Power ICs cover a broad spectrum of different applications that continue to grow in complexity".

"Coupled with wide operating ranges for both voltage and temperature, these designs have posed great challenges for us in the AMS verification domain", said Lyes Djama, AMS Design Platform manager of STMicroelectronics' Smart Power and High Voltage Competence centre.

"Using XA technology allows us to significantly improve the AMS verification of these cutting-edge designs and meet the challenges we are currently facing".

Synopsys' XA acceleration technology allows customers to achieve HSPICE accuracy while delivering far higher performance and capacity than existing FastSpice solutions.

This performance results from technologies including compiled code simulation algorithms for faster transient analysis, topology and behaviour-driven recognition algorithms to optimise simulation capacity, and an adaptive multirate evaluation engine.

When combined with either NanoSim or HSIM, XA acceleration technology delivers a complete transistor-level verification solution with higher accuracy and higher throughput.

"Our collaboration with ST on the new XA technology is another example of a mutually beneficial alliance between Synopsys and our customers", said Paul Lo, Vice President and General Manager of the Analogue/Mixed-signal Group at Synopsys, "Combining Synopsys' expertise in circuit simulation and STMicroelectronics' deep knowledge in analogue design, we are able to deliver technology that addresses the requirements of AMS designers".

ST's smart power technology allows analogue, digital and power circuits to be integrated on a single chip, producing a complete system - including the MCU - on a single piece of silicon.

This level of integration facilitates more compact packaging and delivers significant benefits to manufacturers of automotive systems through lower costs and increased reliability.