Bluetooth trio cover phones, PDAs and PCs

Taiyo Yuden introduces its new line of Bluetooth components with production and distribution of three digital short-range RF modules for wireless communication between portable consumer devices.

Taiyo Yuden introduces its new line of Bluetooth components with production and distribution of three digital short-range RF modules for wireless communication between portable consumer devices.

Combining its expertise in multilayered component manufacturing, high-frequency circuitry design, advanced assembly techniques and evaluation standards with aggressive Bluetooth research and development and strategic partnerships, Taiyo Yuden cements its leadership position in this rapidly emerging market with these product releases.

The products include: a 15.1 x 13.9 x 2.2mm 0dBm power RF module for mobile phone applications; a 33.7 x 16 x 2.2mm 0dBm device for PDA and handheld computing devices; and a 32 x 19.5 x 2.2mm 20dBm for notebook and portable PC applications.

All three comply with Bluetooth specification version 1.0b, operate in the 2.4GHz band, and support both voice and data communications.

The PDA and PC modules incorporate a radio and baseband core with built-in flash memory as well as USB high-speed and UART interfaces for communication capability with the "master" device.

The Taiyo Yuden modules are built around an advanced chipset using silicon-on-insulator (SOI) BiCMOS process technology, which requires less than half the power of CMOS-based chips.

Production costs are reduced by a baseband-to-RF signal direct conversion system, eliminating the need for SAW filters and LC passive filters, and resulting in modules that offer performance, size and cost benefits to OEM designers.

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