Product category:
IC and Hybrid Processing Equipment
News Release from: TDK Electronics Europe | Subject: AMF-15
Edited by the Electronicstalk Editorial
Team on 14 October 2005
Flip chip bonder aids device
miniaturisation
A new flip chip bonder offers an all-in-one process for mounting and bonding in high precision applications.
TDK Electronics Europe has a new flip chip bonder that offers an all-in-one process for mounting and bonding in high precision applications The AFM-15 offers significantly faster bonding at 1.1s per chip (including bonding time), compared with the nearest comparable method of gold-wire bonding
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The AMF-15 is targeted in particular to production of LEDs, RF components and CSPs or any other components that would profit from incorporating the benefits of this new bonding technology.
The AFM-15 flip chip bonder uses the gold-to-gold ultrasonic interconnect mounting method, which allows for significant reduction in weight and size of the package.
Like other TDK products, the AFM-15 also supports lead-free manufacturing.
TDK has developed the flip chip bonder in response to industry demand for further miniaturisation and better electrical properties for products, such as short signal paths and better transfers of frequencies, coupled with enhanced temperature resistance.
Further information about the AFM-15 flip chip bonder will be available at Productronica in Munich (15th to 18th November 2005) at TDK's stand located in Hall A4, 161.
At the exhibition TDK will also showcase the TAS300 FOUP loadport, as well as the MA-2N multifunction mounter.
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