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Tecan
Address:
Tecan Way
Granby Industrial Estate
Weymouth
DT4 9TU
UK
Telephone: (UK) +44 1305 765432
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Listing of all 77 news releases from Tecan:
Small-run metal parts produced fast
Refined to the highest levels to rapidly deliver burr and stress free custom solutions, Tecan offers a 48hr turnaround service for photo-chemical machined (PCM) or 'photo-etched' metal parts.
News from Tecan (18 January 2008)
Waveguide finishes offer choice of properties
Gold- and silver-based plating finishes provide flexible surface properties for custom waveguides in aerospace, defence, medical, security scanning and comms applications.
News from Tecan (24 October 2007)
Electronics encyclopedia provides design guidance
The World of EMI/RFI Enclosures covers all aspects of the design, prototyping and manufacture of off the shelf and custom shielding solutions.
News from Tecan (18 October 2007)
Design service eases EMI screening
Tecan offers tailored design solutions from multi-cavity structures to standard or customised enclosures.
News from Tecan ( 5 October 2007)
Deposition masks suit vacuum applications
Tecan's electroforming process produces tightly toleranced display masks with burr-free aperture edges and controllable draft angles to ensure optimum print definition.
News from Tecan (10 September 2007)
Custom screening cans come quickly
Prototype and custom RFI screening cans are available in just three days with no premium charge.
News from Tecan ( 4 May 2007)
The highway code of stencils
Guide offers the electronics industry a comprehensive reference source of how to achieve the best possible printed results from all types of stencils.
News from Tecan (30 April 2007)
Finishes adapt components' surface properties
Gold-based finishes are designed to provide optimum durability, reliability and/or solderabiilty dependent on the application.
News from Tecan (23 January 2007)
Stencils and squeegees bring lead-free success
A combination of proven design features have been brought together to ensure lead-free printing success through the adoption of stencils and squeegees from Tecan.
News from Tecan (30 October 2006)
Screening cans suit automatic assembly
Standard RFI screening cans can be supplied on pick-and-place tape reels for the convenience of small, medium and high-volume OEMs and CEMs.
News from Tecan ( 2 October 2006)
Single source solution for EMC enclosures
Tecan has a division dedicated to the provision of EMC enclosures which is set up to offer advice and assistance, from initial concept through to volume manufacture
News from Tecan ( 2 August 2006)
Stencils compensate for device inconsistency
Electronic components with mechanically formed leads continue to cause problems as their poor lead coplanarity regularly results in inconsistent solder fillets and open circuits.
News from Tecan ( 8 May 2006)
Environmental management meets ISO14001
Tecan has been granted ISO14001 status for its in-house environmental management systems.
News from Tecan (28 March 2006)
Clips put a new barb on applying PCB screens
New technology can significantly cut the production time needed to solder large RFI screening cans and fences onto printed circuit boards
News from Tecan (13 February 2006)
Single-component stencils speed rework operations
Novel rework stencils ensure accurate and repeatable printed results for single component footprints, such as QFPs, PLCCs, BGAs, micro-BGAs and surface-mount connectors.
News from Tecan (11 January 2006)
Evaporation masks are robust and accurate
Evaporation masks, for use across a wide range of selective vacuum chamber processes, have been further enhanced by Tecan - combining coplanar rigidity with optimum aperture accuracy.
News from Tecan (28 November 2005)
Multilevel stencils minimise post-print rework
Tecan is ramping up production of its multilevel stencils to meet increasing demand from PCB builders.
News from Tecan ( 3 October 2005)
Screening cans provide RFI protection onboard
Low-profile PCB screening cans and enclosures, which can be reflowed with conventional and SMD components, are now available from Tecan.
News from Tecan (28 February 2005)
Stencils smooth transition to lead-free processing
A combination of proven design features will ensure solder paste printing stencils offer the best possible performance when faced with present-day and future challenges facing PCB manufacturers.
News from Tecan (22 December 2004)
Cost-effective RFI screening solutions
Tecan offers a "total screening" service which is dedicated to the cost-effective delivery of both standard and custom solutions, from design to prototype and volume production.
News from Tecan (26 October 2004)
Stencils ensure accurate rework
Semiconductor leadframes made to order
Optical encoder discs made to (exact) order
Californian opening signals global expansion
Frameless stencils appeal to Control Techniques
Labyrinth screening speeds PCB assembly
Novel stencil pattern encourages paste roll
Polished blades clean up on lead-free processing
Stencils smooth the switch to lead-free processing
Fast RFI solutions spring from standard-pitch cans
Ultraclean lids are critical to hybrid success
Conference addresses PCB process optimisation
Single source for PCB rework tools
Vacuum deposition masks lead display advances
Wafer producers see potential of microreplication
Speedy metal prototypes made to order
Wafer-bumping stencils maintain accuracy
Interest grows in microstructures
Interactive website ousts printed matter
Stencils optimise paste release
Cost-effective bespoke screening solutions
Storage system keeps stencils in top condition
Photochemical machining produces robust MEMS
Multilevel solder stencils aid pin-in-hole reflow
Royal assent for microstructure manufacturing
Prototype and preproduction flat metal components
Evaporation masks minimise process costs
Stencils keep boards tidy during rework
Automated optical inspection aids stencil quality
Imprint patterning creates higher density PCBs
High-spec leadframes from a single supplier
Hybrid lids fabricated and plated on same site
Reflector shield saves sensitive components
Stencil-handling system saves time and money
Plating for everyday and niche applications
Photo-electroforming provides precise components
Cost-cutting labyrinth screens gain market share
Wafer-bumping stencils deposit paste accurately
Accuracy is key for shadow masks
Bespoke solutions from surface finishing facility
Seminars promote advantages of pin-in-hole reflow
Tecan pools its RFI screening resources
High-accuracy encoders produced to order
Screens and meshes get higher and more rigid
Electroformed leadframes are more economical
Accurate meshes, screens, filters and sieves
Enhanced squeegee technology aids solder printing
Small footprint screening cans... just in time
Electroformed wafer-bumping stencils
Dummies check placement to improve yields
Tighter tolerances for nickel evaporation masks
Prototype micro metal parts in five days
Labyrinth RFI screening can brings RFI benefits
Mini rework stencils save time and money
Can-on-board solder migration problems solved

