Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Mini stencils
Edited by the Electronicstalk Editorial
Team on 02 January 2001
Mini rework stencils save time and money
Mini stencils from Tecan Stencils ensure accurate repeatable paste deposits are produced when replacing components such as QFPs, PLCCs and BGAs during PCB rework operations.
Mini stencils from Tecan Stencils ensure accurate repeatable paste deposits are produced when replacing components such as QFPs, PLCCs and BGAs during PCB rework operations Individual component footprints are faithfully replicated by the mini stencils, with apertures which precisely correspond to the pads on the PCB from where the original component was removed
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
Related stories
Can-on-board solder migration problems solved
Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'.
Labyrinth RFI screening can brings RFI benefits
A labyrinth RFI screening can is an effective one-part board-level alternative for PCB designs which would otherwise require solid metal enclosures or multiple screening cans.
Rework is completed in a cost effective and controlled manner with far more consistent results than traditional 'hit and miss' methods.
In combination with a rework station, the stencils ensure human error and alignment problems are significantly reduced resulting in a controlled 'right first time' solution.
In operation, the stencil is simply placed in position on the 'cleaned' pads and paste is deposited by hand using a mini squeegee blade.
The accurate apertures ensure exactly the right amount of paste is deposited, folded edges provide protection from any overspill, localised reflow follows.
The stencils are supplied as assemblies complete with all necessary interfaces, such as articulated stalks or vacuum attachments, for the rework station or placement system adopted.
Accurately folded edges and run-on/run-off areas ensure that the compact stencil does not interfere with other components on the populated PCB.
Mini stencils are also available for reballing and fluxing BGAs and for SM connectors and similar components.
Mechanical and thermal stresses are kept to a minimum using the technique allowing devices to be re-flowed without exceeding manufacturers' recommended stress limits.
• Tecan: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
