Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Electroformed wafer-bumping stencils
Edited by the Electronicstalk Editorial
Team on 12 March 2001
Electroformed wafer-bumping stencils
Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL) are used to accurately deposit solder paste directly onto silicon wafer die.
from Tecan Stencils Limited (TSL) are used to accurately deposit solder paste directly onto silicon wafer die Following reflow, the paste forms the conductive solder bumps required for I/O
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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Can-on-board solder migration problems solved
Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'.
Labyrinth RFI screening can brings RFI benefits
A labyrinth RFI screening can is an effective one-part board-level alternative for PCB designs which would otherwise require solid metal enclosures or multiple screening cans.
Highly accurate and repeatable results are offered by the stencils which allow users to cost effectively maximise the available yield from a given wafer.
The stencil apertures have very smooth walls, with a trapezoidal cross-section, which ensure optimum paste release characteristics - improving the consistency of solder paste volume and hence, ball size and regularity.
The stencils cater for the increasingly high component densities and pitches associated with components such as chip-scale packages, micro ball-grid arrays and flip-chip designs.
For example, a typical stencil for a multi-die six-inch wafer may require 300,000 apertures, or over 500,000 for an eight-inch wafer, with hole diameters of 60 to 125 microns.
The technology represents a significant step forward in the reduction of production costs for such increasingly miniaturised silicon substrate electronics components.
It also ensures compatibility with existing SMT processes.
Process control is a fundamental element in the success of CSP, BGA and similar packaging.
The adoption of TSL electroformed stencils provides the ability to tightly control each assembly process to ensure repeatable high yields.
Designs can be submitted as CAD files and the company offers a maximum five-day despatch prototyping service.
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