Product category:
Boards and Backplanes
News Release from: Tecan | Subject: Semiconductor leadframes
Edited by the Electronicstalk Editorial
Team on 22 May 2001
Electroformed leadframes are more
economical
Tecan Components has developed new manufacturing techniques for the production of semiconductor leadframes, offering significantly higher specifications than traditional techniques.
Tecan Components has developed new manufacturing techniques for the production of semiconductor leadframes, offering significantly higher specifications than traditional techniques to produce economical parts with increased lead density and higher accuracy Traditional methods of leadframe manufacture include photochemical machining and machine punched parts for high-volume production needs, but the techniques have mechanical accuracy limitations
This article was originally published on Electronicstalk on 17 Apr 2002 at 8.00am (UK)
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High-tolerance manufacturing technology lies behind the production of exceptionally cost-effective semiconductor leadframes.
Semiconductor leadframes made to order
Tecan is now routinely producing high-accuracy bespoke semiconductor leadframes it claims deliver a range of inherent benefits compared with traditional "stamped" products.
As electronic component packaging moves towards ever-smaller requirements the physical restrictions of these methods have been reached.
With proven electroforming technology, Tecan has mapped the way forward by producing leadframes, in any volume and to such high accuracy, that parts can now be made half the original size or with double the lead capacity for the same footprint.
Fine-pitch dimensions and tolerances can now be catered for which were previously not possible or were prohibitively expensive.
Application areas are wide and varied, covering low and high-lead-count semiconductor and other multilead component needs across the full spectrum of the electronics manufacturing market.
The company is able to supply quantities at all levels of production - from rapid prototypes and small-batch samples, to medium and high-volume needs.
The parts can be supplied gold plated and cater for all modern production and assembly techniques - from loose parts, to waffle trays, or tape and reel.
Subject to acceptance, a bespoke rapid prototype service guarantees despatch of first samples within five working days.
In addition to rapid delivery of the first low-volume parts, the service has other benefits.
For example, once a part is adopted, down-the-line production speeds and costs are reduced because the tooling is already in place.
Modifications can be cost-effectively incorporated within the company's powerful CAD system, ensuring any knock-on tooling costs are also minimised.
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