Product category:
Electronics Manufacturing Services
News Release from: Tecan
Edited by the Electronicstalk Editorial
Team on 08 August 2001
Seminars promote advantages of
pin-in-hole reflow
Tecan Stencils (TSL) is to host a series of autumn seminars highlighting the advantages of pin-in-hole reflow (PIHR).
Tecan Stencils (TSL) is to host a series of autumn seminars highlighting the advantages of pin-in-hole reflow (PIHR) PIHR is a technology aimed at PCB producers wishing to assemble both SMT and through-hole components on the same board
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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Using a combination of multilevel stencils and reactive squeegees in a single operation, PIHR can eliminate the need for subsequent hand or wave soldering.
The technique ensures the appropriate paste volumes are deposited, for SM and through-hole components simultaneously - producing shorter product cycle times, reduced manufacturing costs and eliminating second-operation flux deposits.
Multilevel stencils offer distinct thicknesses on the same stencil, tailored to deliver the extra paste volumes required for PIHR needs, such as connectors, while also ensuring the appropriate thickness for the finest pitch SM components.
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Careful calculation of the appropriate individual paste volumes required is crucial, says the company, to ensure the resultant solder fillets meet acceptable quality criteria.
"We pride ourselves as always being at the forefront of screen printing technology, not just as suppliers, but hand-in-hand with leading companies and new technology development", said TSL divisional manager Tony Weldon.
"We knew the response would be big, but were surprised that it was so big - we seem to have hit upon the industry's hottest topic - certainly in PCB manufacturing".
Other factors essential to the success of the technique include printing "off pad", accurate insertion of through-hole components (with limited lead lengths), appropriate squeegee pressure and speed, and suitable thermal tolerance characteristics of the component body.
It is not always necessary to use multilevel stencils: the company can provide optimised stencils, cost-effectively, whatever the individual need.
The highly accurate stencils can be produced by using precision etching in combination with laser cutting, or by electroforming - ensuring complete solutions combining every appropriate technique.
Using the new methods, and provided the recommended guidelines are followed, the technology is compatible with existing production techniques, personnel and processes.
The advantages, process development and hands-on implementation will be demonstrated.
The first seminar will be held at TWI North, Middlesbrough, on Wednesday 12th September.
Tony Weldon, TSL, will present theoretical aspects and stencil solutions.
Consultant, industry guru and SMART Group honorary vice-president Bob Willis will review connector suitability, PIHR process development and PCB design.
For details of other seminar venues and dates e-mail louise.colling@tecan.co.uk.
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