Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Multilevel solder stencils
Edited by the Electronicstalk Editorial
Team on 01 November 2002
Multilevel solder stencils aid
pin-in-hole reflow
As the PCB manufacturing industry increasingly adopts the beneficial concept of pin-in-hole reflow, Tecan continues to boost its share of this developing new market.
As the PCB manufacturing industry increasingly adopts the beneficial concept of pin-in-hole reflow, Dorset based stencil specialist Tecan, continues to boost its share of this developing new market, by providing feasible custom stencil solutions Pin-in-hole reflow (PIHR) is a technology aimed at PCB producers wishing to assemble both SMT and through-hole components on the same board
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
Related stories
Can-on-board solder migration problems solved
Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'.
Labyrinth RFI screening can brings RFI benefits
A labyrinth RFI screening can is an effective one-part board-level alternative for PCB designs which would otherwise require solid metal enclosures or multiple screening cans.
Using a combination of multilevel stencils and reactive squeegees in a single operation, PIHR can eliminate the need for subsequent hand or wave soldering.
The technique ensures that appropriate paste volumes are deposited, for SM and through-hole components simultaneously.
This produces shorter product cycle times, reduces manufacturing costs, eliminates secondary flux deposition and negates the need for subsequent hand or wave soldering.
Further reading
Mini rework stencils save time and money
Mini stencils from Tecan Stencils ensure accurate repeatable paste deposits are produced when replacing components such as QFPs, PLCCs and BGAs during PCB rework operations.
Prototype micro metal parts in five days
A five-day prototype service has been launched by Tecan, offering design engineers cost-effective small sheet metal parts for a vast array of applications.
Tighter tolerances for nickel evaporation masks
Tecan has developed a range of high-performance nickel evaporation masks, for use in a range of selective vacuum chamber deposition processes, such as gold and silver plating on silicon.
As a world leader with unprecedented expertise, the company offers solutions for all-known difficulties experienced by manufacturers to date, dealing with a diverse range of PCB production requirements.
For example, its multilevel stencils offer distinct thicknesses on the same stencil, tailored to produce the extra volumes required for PIHR needs, such as connectors, while also ensuring the appropriate thickness for the finest pitch SM components.
Careful calculation of the appropriate individual paste volumes required is crucial, says the company, to ensure the resultant solder fillets meet acceptable quality criteria.
A selection of the factors for consideration when designing for success include, the size and shape of paste deposits, pad size and proximity, solder resist selection, component temperature specification, correct paste volume, stencil thickness, substrate quality and other potential constraints.
The company has the unique ability to then produce the optimum stencil for an individual job.
Significantly, a service is also provided which involves taking a given PCB in-house to prove the resultant stencil is totally fit-for-purpose.
Crucially supplemental to the company's PIHR stencil capability are its proprietary reflow reflector shields - custom built parts which fit over leaded components, such as connectors, crystal oscillators and switches, during the reflow process.
Typically, these components are those which were not originally designed to cope with reflow oven temperatures.
Until now, such components have presented problems for PCB producers because they have to be hand, or wave-soldered as a second operation, following the reflow of SMD components.
The reflow reflector shield completely negates the need for two operations.
It is not always necessary to use multilevel stencils, the company can provide optimum stencil solutions, cost-effectively, whatever the individual need.
The highly accurate stencils can be produced by using precision etching in combination with laser cutting, or by electroforming - all in-house.
Using the new methods, and provided the recommended guidelines are followed, the technology is compatible with existing production techniques, personnel and processes.
• Tecan: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
