Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Tecan
Edited by the Electronicstalk Editorial
Team on 02 April 2003
Interactive website ousts printed matter
A wealth of data is now available from Tecan's new interactive website, in the form of quick and easy to download PDF files.
For over three decades, Dorset based Tecan has built an unsurpassed global reputation in the provision of RFI screening, solder paste stencils, photo-etching and electroforming to produce high-accuracy micro-specification and micro-size metal parts A wealth of data is now available across these application areas from the company's new interactive website, in the form of quick and easy to download PDF files
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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Can-on-board solder migration problems solved
Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'.
Labyrinth RFI screening can brings RFI benefits
A labyrinth RFI screening can is an effective one-part board-level alternative for PCB designs which would otherwise require solid metal enclosures or multiple screening cans.
Next-generation thinking remains at the forefront of the company's activities.
The new move, away from traditional printed and mailed datasheets and brochures, is seen as a way of ensuring new and existing customers receive the latest possible data at any given time, for any given service, product or capability.
Processes and products are dealt with separately, making the location of relevant material easy.
Further reading
Mini rework stencils save time and money
Mini stencils from Tecan Stencils ensure accurate repeatable paste deposits are produced when replacing components such as QFPs, PLCCs and BGAs during PCB rework operations.
Prototype micro metal parts in five days
A five-day prototype service has been launched by Tecan, offering design engineers cost-effective small sheet metal parts for a vast array of applications.
The information provided is designed to be both succinct and sufficiently detailed to satisfy the immediate needs of those downloading it.
Attention to detail is typified by the USA-Asia site, for example, automatically formatting documents for US standard paper, with the UK site delivering A4 formatted files.
A free binder is available for those wishing to file their printouts in a convenient way.
Recently, the company has breached traditional manufacturing obstacles to deliver low-cost micro metal parts, and larger parts with ultra-fine features, for a vast new applications arena covering electronics, optical, medical and aerospace.
Inherent advantages of the technology are expected to be exploited by a wide range of industries, for demanding next-generation micro applications, where products will be made significantly smaller and finer, repeatedly, at lower cost and with fewer production processes.
The company has created a hybrid from three established manufacturing technologies: silicon semiconductor; high-volume audio CD; and micro embossing tools such as those used for micro-lens arrays and hologram manufacture.
This new and exciting mixture of processes has been specifically created for the emerging demands for micro structures and ultra-high-definition micro replication.
Exceptional tolerances and accuracy are assured over a total surface area of 300 x 300mm far greater than most existing silicon capabilities.
Producing micro parts in Nickel as opposed to silicon also provides a multitude of benefits such as cost, flexibility, conductivity and has excellent optical properties and capabilities.
Typical OEM requirements have been large micro embossing tools for micro lens arrays, toolfoils for imprinting microcircuits.
MEMS and MOEM devices, Highly accurate vacuum deposition and evaporation masks, micro fluidic channels, meshes and sieves.
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