Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: PCB rework tools
Edited by the Electronicstalk Editorial
Team on 22 September 2003
Single source for PCB rework tools
PCB rework tools can take many forms, and to source them all from a single supplier has not traditionally been easy.
PCB rework tools can take many forms, and to source them all from a single supplier has not traditionally been easy From its diverse portfolio, established specialist Tecan offers a comprehensive selection of time- and cost-saving alternatives, from mini rework stencils to reflow reflector shields
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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From its extensive knowledge and technical experience, the company offers an unusually adaptable approach.
In addition to the provision of specialised rework tools and accessories, it provides personalised help and advice to overcome the most demanding needs.
Typical solutions currently satisfying real-life needs include dip transfer plates, mini rework stencils, BGA reballing stencils, direct component printing stencils and reflow reflector shields.
Further reading
Mini rework stencils save time and money
Mini stencils from Tecan Stencils ensure accurate repeatable paste deposits are produced when replacing components such as QFPs, PLCCs and BGAs during PCB rework operations.
Prototype micro metal parts in five days
A five-day prototype service has been launched by Tecan, offering design engineers cost-effective small sheet metal parts for a vast array of applications.
Dip transfer plates enable the accurate application of precise flux volumes to the lower quartile of the solder balls of ball grid array (BGA) components, thereby eliminating excessive flux contamination on the underside of the reflowed component.
Mini rework stencils are used to replicate a single electronic device footprint to deliver accurate, consistent printed paste deposits for the finest of component pitches.
Options range from simple handheld stencils to those which need to interface with a rework station.
These rework stencils assure accurate and repeatable printed results for components such as QFPs, PLCCs, BGAs, uBGAs and SM connectors when replaced during PCB rework operations.
The stencils mimic the footprints and aperture sizes corresponding to both the device and the major stencil used in the original production.
In combination with a rework station, alignment is simplified, resulting in a controlled "right first time" process.
BGA reballing stencils offer advantages in two areas.
Firstly, to ensure the precise registration of new solder spheres onto preprinted flux deposits, and secondly, in the form of the thicker stencils necessary for printing solder paste onto the BGA itself to create new solder sphere terminations.
For depositing paste onto the pads of the BGA device itself, where the printed device will be picked and placed onto the PCB and subsequently reflowed, direct component printing stencils are used.
During reflow, the companyûs reflow reflector shields provide critical protection for heat sensitive components on densely populated PCBs, where an adjacent device is to be reworked/reflowed.
The reflow shields are custom-made to fit over leaded components such as connectors, crystal oscillators, switches, inductors and capacitors, during reflow.
In the reflow oven the shield reflects heat energy, thereby preventing damage to the component body, while simultaneously allowing conducted heat from the bottom of the PCB to reflow the solder paste effectively, ensuring a good joint every time.
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