Product category:
Exhibitions, Courses, Conferences and Training
News Release from: Tecan
Edited by the Electronicstalk Editorial
Team on 03 October 2003
Conference addresses PCB process
optimisation
"Final finish" is a one-day printed circuit board conference aimed at designers, PCB fabricators, assemblers, OEMs and CEMs to be held on 22nd October 2003.
On 22nd October 2003, printed circuit process specialist MacDermid, and stencil specialist Tecan, will jointly host "Final finish", a one-day printed circuit board (PCB) conference aimed at designers, PCB fabricators, assemblers, OEMs and CEMs The event will be held at the Hayley Conference Centre, Ettington Chase, Stratford, UK
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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Following a welcome address, delegates will be presented with a series of detailed conference sessions covering a wide range of current and future technologies relevant to the optimisation of PCB manufacturing processes.
The morning will be dedicated to the following areas of interest: Planar - electroless nickel/gold; M Coat Plus - OCP; Macstan - immersion tin; and Sterling - immersion silver.
Following a buffet luncheon, the afternoon session will look at: the assembly of PCB surface finishes; and stencil design influences with regard to lead-free print processing.
The stencil session will be presented by Tecan and will look closely at the key to optimising the surface-mount line through control of the print process itself.
The company's paper will look at the stencil design issues involved in achieving control of the print process.
These include: available stencil technology choices; aperture sizes and reductions required to achieve the desired solder fillets; selection of individual stencil thicknesses appropriate to the mix of components on today's assemblies.
The conference will conclude with an open forum.
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