Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Hybrid electronics packages
Edited by the Electronicstalk Editorial
Team on 07 November 2003
Ultraclean lids are critical to hybrid
success
Ensuring expensive hybrid electronics packages are encapsulated with an enclosure system that does not compromise the package or its contents has not traditionally been as easy as it may first appear.
Ensuring expensive hybrid electronics packages are encapsulated with an enclosure system that does not compromise the package or its contents has not traditionally been as easy as it may first appear Hybrid package lids are often manufactured by third parties and with varying degrees of compatibility
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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Challenging recognised standards, Dorset based Tecan has recently proven its leading-edge manufacturing capability having been awarded a contract to supply the USA's largest surface acoustic wave (SAW) device manufacturer with hybrid high-specification package lids on a regular high-volume basis.
The requirement was extremely demanding in terms of finished product cleanliness, accuracy and quality.
The tolerances on the lid to tub sealing process were so rigorous that the smallest dirt particle on the lid could cause the device to be rejected and scrapped.
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Although the lid cost is relatively low, the device cost is extremely high; therefore the lid is a critical part of the assembly and must be produced with both repeatable accuracy and cleanliness to ensure the highest possible yields.
Tecan is believed to be the only company able to provide all necessary manufacturing techniques under one roof, which is fundamental in ensuring the most consistent and repeatable quality available, for either flat or stepped lids.
Electroplating, for example is a function often contracted out by lid makers, a crucial area where in-house quality control ensures accuracy and repeatability.
So comprehensive is the service, that lids can be produced without manufacturing "tags" or "witness marks" assuring the absolute uniformity necessary for accurate bonding to the recipient hybrid tub.
"Our client's requirement pushed the boundaries of conventional lid manufacturing, encouraging us to invest considerable time and effort to develop an appropriate solution, including a Class 100 clean area", said Leon McMahon, Marketing Manager, Tecan.
"Following almost three years of dedicated development work, Tecan was recently awarded the lid contract, which represents significant and regular high-volume orders.
The customer has informed us that our determination and persistence to achieve its unusually high demands were important factors in our being awarded the contract.
Our proven manufacturing, in-house plating and total quality control capabilities were also crucial throughout".
Lid solutions for all volume levels and specifications can be supplied by the single-source company - with rapid prototyping available on a five-day turnaround.
Tooling costs are low compared to other methods of manufacture and modifications can be quickly and cost-effectively accommodated.
Tecan operates a strict ISO9002 manufacturing regime and can manufacture to military specifications.
SAW technology is playing an increasingly important role in all end-user industries but particularly Aerospace, defence and telecomms.
SAW devices provide features and a level of performance not possible using other technologies.
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