Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Semiconductor leadframes
Edited by the Electronicstalk Editorial
Team on 01 September 2004
Semiconductor leadframes made to order
Tecan is now routinely producing high-accuracy bespoke semiconductor leadframes it claims deliver a range of inherent benefits compared with traditional "stamped" products.
Tecan is now routinely producing high-accuracy bespoke semiconductor leadframes it claims deliver a range of inherent benefits compared with traditional "stamped" products From a single manufacturing facility, encompassing fabrication, forming and finishing, the company produces burr and stress-free leadframes on a rapid turnaround basis - negating the traditional time, price and quality control problems associated with outsourcing
This article was originally published on Electronicstalk on 22 May 2001 at 8.00am (UK)
Related stories
Electroformed leadframes are more economical
Tecan Components has developed new manufacturing techniques for the production of semiconductor leadframes, offering significantly higher specifications than traditional techniques.
High-spec leadframes from a single supplier
High-tolerance manufacturing technology lies behind the production of exceptionally cost-effective semiconductor leadframes.
By exploiting low-cost phototooling and proprietary photochemical machining and photo-electroforming techniques, the company has become a leader in the provision of prototype, preproduction, low-volume and specialised leadframes.
"Our customer base is expanding in proportion with the increasingly demanding electronics marketplace, where speed and accuracy can not be compromised", said Shaun Mason, Component Development Manager, Tecan.
"We regularly get involved with development work at the leading-edge of design, producing next-generation leadframes which can incorporate any number of customised performance characteristics".
"Speed and accuracy go hand-in-hand with flexibility and cost-efficiency - for both standard parts and niche application requirements".
As significantly inexpensive alternatives to stamped parts, Tecan leadframes can accommodate ultrafine pitch designs with no cost premium, catering for today's increasingly complex and high-pin-count devices.
Typical tolerances and feature sizes can be as low as +/-2um.
Unique characteristics, such as post-process rounded leads for hermetic sealing, can also be readily incorporated.
In-house plating is also available with options such as electroless nickel, hard acid gold and pure soft gold.
From initial design drawings, low-cost tooling is created to speedily produce prototypes.
Down-the-line design modifications are equally cost-effective and rapid - allowing specifiers and designers to bring optimised designs to market on time and to budget.
• Tecan: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
