Product category:
EMC Components
News Release from: Tecan | Subject: Tecan EMI/RFI solutions
Edited by the Electronicstalk Editorial
Team on 05 October 2007
Design service eases EMI screening
Tecan offers tailored design solutions from multi-cavity structures to standard or customised enclosures.
Tecan is now offering free design assistance to electronics designers looking for solutions to EMI/RFI problems Tecan offers tailored design solutions from multi-cavity structures to standard or customised enclosures, in some cases designed and dispatched in 48 hours
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'.
The company welcomes entry into its system at any level, from those who know they need screening but don't know where to go next, to those with fully-dimensioned drawings needing professional enhancements to incorporate special manufacturing techniques or advice on suitable materials for ROHS compliancy.
Tecan also offers site visits, rapid prototyping, sample production, finish and thickness options, forming, assembly and re-evaluation for cost reduction.
The company uses a range of well-established and proven manufacturing systems, such as photo-chemical machining (PCM) and punch-and-press, to provide cans for the most demanding low, medium and high-volume production needs.
Typical enclosures may include options such as fences, dividing walls, five-sided enclosures, multi-cavity, full enclosures, spring-fingered lids, simple fold lids, folding spring lids and screening meshes.
Resultant fabrications are compatible with all standard production requirements, including surface-mount, and are also suitable for pick and place assembly.
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