Product category:
ATE Systems
News Release from: Teradyne | Subject: Optima 7350
Edited by the Electronicstalk Editorial
Team on 06 April 2001
AOI system sees all solder faults on the
dark side
Teradyne reckons its Optima 7350 Post-Solder Bottomside AOI System is the industry's only bottomside automated inspection system for full solder defect coverage.
Teradyne reckons its Optima 7350 Post-Solder Bottomside AOI System is the industry's only bottomside automated inspection system for full solder defect coverage The Optima 7350 provides high-throughput, full-coverage inspection, matching line beat rates regardless of PCB size or density
This article was originally published on Electronicstalk on 4 May 2001 at 8.00am (UK)
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The system inspects the full spectrum of component and solder defects, including presence or absence of parts, part size, alignment and orientation, placement accuracy and integrity of solder, to provide 100 percent defect coverage and extremely low false flag/accept rates.
The Optima 7350 shares robust software and hardware technology with Teradyne's highly successful Optima 7300 topside inspection system.
On the 7350 model, this powerful technology inspects the PCB from the bottom in its native position, ideal for inspecting pre- and post-press insertion defects in compliant and VHDM (very high density modular) connectors, double-sided, reflowed PCBs, as well as pre- and post-wave inspection of through-hole components.
Further reading
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Teradyne has released wht it describes as an "online interactive product experience module", or PEM, to promote its Optima 7000 Series of automated optical inspection systems.
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New from Teradyne's Assembly Test Division (ATD) is the GRPX1040 CompactPCI C-band optical amplifier, the latest addition to its GR VersaOT optical communications test product portfolio.
Inspection solutions on show in Shanghai
Teradyne's Assembly Test Division is to exhibit its major electronics manufacturing test and inspection solutions at the Nepcon Shanghai tradeshow from 9th to 12th April 2002.
Native bottomside inspection eliminates the need for the PCB flippers and avoids the costs and floorspace considerations associated with such equipment.
As PCBs continue to become smaller and more densely configured, reliable bottomside inspection and full defect coverage make the Optima 7350 an ideal tool for quality assurance and process control.
By employing the system at key process points, users can confirm factors such as component and pin alignment, thereby avoiding assembly errors prior to soldering, then inspect again after soldering to assure solder-joint quality.
Detecting and identifying defects at these points allows the Optima 7350 to improve downstream quality and yields while providing valuable process-control data.
The Optima 7350's unique, bottomside approach also makes it well suited for multi-stage, high-density connector assembly.
For through-hole connectors, the system can fully inspect each of several hundred pins for proper alignment at partial insertion, full insertion and after soldering.
This is also valuable for compliant connector applications, allowing manufacturers to ensure proper pin placement before the pins are driven through the PCB and the assembly can still be reworked.
The Optima 7350 combines industry-leading image-capture, camera and lighting technologies to deliver the highest available throughput with 100 percent defect coverage, the lowest false-failure rate in the industry, fast programming and ramp-to-production, as well as consistent, reliable results from system to system.
A patented configuration of vertical and angled high-speed cameras works with a proprietary system of structured LED illumination to support Teradyne's TenPhase image-acquisition system, which captures ten images of every field-of-view on the PCB with optimum lighting for each image.
Teradyne has leveraged the repeatability of the Optima 7350 to deliver CopyExact capability across multiple machines.
Inspection programs can be transported between machines, lines and locations with identical performance and results, eliminating program adjustment or reprogramming and ensuring fast production ramp for new systems.
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