Product category:
ATE Systems
News Release from: Teradyne | Subject: Nepcon Shanghai
Edited by the Electronicstalk Editorial
Team on 08 April 2002
Inspection solutions on show in Shanghai
Teradyne's Assembly Test Division is to exhibit its major electronics manufacturing test and inspection solutions at the Nepcon Shanghai tradeshow from 9th to 12th April 2002.
Teradyne's Assembly Test Division is to exhibit its major electronics manufacturing test and inspection solutions at the Nepcon Shanghai tradeshow from 9th to 12th April 2002 "Nepcon Shanghai is an ideal opportunity for us to demonstrate the breadth and depth of Teradyne's unique product range", said Patrick Tong, General Manager of Teradyne Asia
This article was originally published on Electronicstalk on 6 Apr 2001 at 8.00am (UK)
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"Teradyne provides electronics manufacturers with leading edge test and inspection solutions to overcome today's design, manufacturing and test challenges, and deliver technologically distinctive products to their markets faster and more cost effectively than the competition".
"Our hardware and software offerings provide electronics manufacturers with the most comprehensive and effectual range of test and inspection solutions available and they allow manufacturers to focus on achieving precise test requirements more cost effectively", Tong added.
"While we have worked with original equipment and contract electronics manufacturers throughout the Asia-Pacific region for many years, Nepcon in Shanghai is a special opportunity to introduce the most complete portfolio of test and inspection solutions in the industry to an even wider audience".
Teradyne will be featuring the following test and inspection solutions at Nepcon Shanghai: the Optima 7200 post-placement automated optical inspection system; the Optima 7300 post-reflow automated optical inspection system; GR TestStation 124 ICT board test; GR Versa cell phone in-process test solution; and the XStation 130L manual x-ray inspection solution.
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