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Product category: ATE Systems
News Release from: Teradyne | Subject: SMT exhibits
Edited by the Electronicstalk Editorial Team on 31 May 2002

New level of integration at SMT

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Teradyne's Assembly Test Division is to exhibit its major electronics manufacturing test and inspection solutions at SMT/Hybrid/Packaging, from 18th to 20th June 2002 at Nuremberg Trade Fair Centre.

Teradyne's Assembly Test Division is to exhibit its major electronics manufacturing test and inspection solutions at SMT/Hybrid/Packaging, from 18th to 20th June 2002 at the Nuremberg Trade Fair Centre "SMT is an ideal opportunity for us to demonstrate the breadth and depth of Teradyne's unique product range", said Siegmund Hornig, Teradyne's European Sales Manager

"Teradyne has been working hard since the merger with the former GenRad to develop integrated solutions which overcome today's design, manufacturing and test challenges, and deliver technologically distinctive products to their markets faster and more cost effectively than the competition.

I believe we will be able to demonstrate a new level of integration at SMT".

Teradyne's hardware and software offerings provide electronics manufacturers with the most comprehensive and effective range of test and inspection solutions available and they allow manufacturers to focus on achieving precise test requirements more cost effectively.

Teradyne will be featuring the following test and inspection solutions at SMT this year: Optima 7300 post-reflow automated optical inspection system; XStation HS digital 2D X-ray inspection solution; Inline Spectrum board test solution in association with Pematech Rohwedder; Pilot LX flying prober; Summit 1100 rework station; and GR Force/Stategist line optimisation software.

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