Product category:
Stand-Alone Instruments
News Release from: Tektronix
Edited by the Electronicstalk Editorial
Team on 30 September 2005
VIA signs for serial development systems
VIA Technologies has selected digital systems analysis tools from Tektronix to develop digital products based on serial data standards such as second-generation PCI-Express and SATA III.
VIA Technologies, a leading developer of silicon chip technologies and platform solutions, has selected digital systems analysis tools from Tektronix to develop digital products based on serial data standards such as second-generation PCI-Express and SATA III The integrated Tektronix solution, consisting of TLA7000 logic analysers and ultra-high-performance TDS6000 oscilloscopes, will enable VIA's engineers to perform design validation, and comprehensive interoperability and compliance testing on digital products based on PCI-Express and SATA III specifications
This article was originally published on Electronicstalk on 19 Aug 2008 at 8.00am (UK)
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For its measurement needs VIA selected the new Tektronix TLA7012 and TLA7016 logic analysers, the 12GHz TDS6124C oscilloscope and the 15GHz TDS6154C, the fastest real-time oscilloscope in the world.
TLA7000 Series logic analysers include the iLink toolset which seamlessly integrates the logic analyser with an oscilloscope to provide instant digital and analogue insight, and radically speeds the debugging of multiple signals.
"VIA has kept ahead of the industry through anticipating appropriate upcoming technologies and implementing them either as discrete silicon or integrated into the widest range of core logic chipsets in the industry", said Chewei Lin, Vice President of Product Marketing at VIA Technologies.
"High-speed serial buses such as second-generation PCI Express and SATA III present new challenges when making design and compliance measurements The combination of TLA7000 logic analysers and TDS6000 oscilloscopes from Tektronix supports our measurement needs at each stage of design, validation, compliance and debug, and will enable our engineers to test high-speed serial designs with total confidence".
"VIA Technologies has a distinguished history of innovation and we are delighted that they have again selected Tektronix' measurement solutions to drive development of their next generation products", said Bob Agnes, Vice President of Tektronix Asia Pacific Sales and Operations.
"These ultra-high-performance Tektronix instruments will enable VIA's engineers to resolve validation and compliance issues quickly and efficiently, reducing time-to-market while ensuring world class levels of product quality and reliability". Request free introductory details about products from Tektronix ...
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