Scope software brings S-parameters to serial tests
IConnect software runs on Tektronix TDS8200 series sampling oscilloscopes to provide engineers with a measurement-based performance characterisation of gigabit interconnects links and devices.
Engineers are challenged to accurately characterise the effects of the signal path on multigigabit serial data signals.
Most methods to achieve this characterisation are both difficult and expensive.
IConnect software from Tektronix runs on Tektronix TDS8200 series sampling oscilloscopes to provide engineers with a measurement-based performance characterisation of gigabit interconnects links and devices, and does so with reduced complexity and cost.
Applications of IConnect include signal path integrity analysis, impedance characterisation, S-parameters (insertion and return loss), eye diagram compliance tests and fault isolation.
Version 3.6 of IConnect that adds new features and capabilities leading to further improvements in engineering efficiency and ease-of-test.
IConnect version 3.6 has added 50ohm calibration to its true impedance profile (Z-line), enhancing the accuracy of impedance measurements.
In the new release, IConnect also added the ability to generate an eye diagram including crosstalk effects for a passive interconnect link - up to eight aggressors can be included when generating the eye.
Finally, version 3.6 provided capability to export two- and four-port Touchstone S-parameter files, to support the growing need for inclusion of S-parameters in digital system simulation.
IConnect S-parameters and Z-line is available as part of IConnect, and is also available as a stand-alone tool.
IConnect Z-line improves impedance measurement accuracy for complex multi-impedance interconnects, helps to locate failures more easily and improves oscilloscope resolution and accuracy.
Tektronix pioneered the TDR-based S-parameter measurements, and today IConnect S-parameters provides the most cost-efficient and fast-throughput approach for S-parameter measurements in digital design, signal integrity analysis, and interconnect compliance testing.
Using this approach, customers can save 50% compared with traditional VNA S-parameter measurement equipment of the same bandwidth, and dramatically decrease the time required to make the needed measurements.
S-parameter calibration using a reference waveform (open, short or through) and an optional 50ohm load waveform simplify making the measurement, fixture de-embedding and moving the reference plane.
Engineers and technicians performing compliance testing need to execute tests such as insertion and return loss (S-parameters) and eye diagram with crosstalk as required by electrical standards such as Serial ATA, PCI Express, Infiniband and gigabit Ethernet.
As digital speeds go above 2-3Gbit/s, it is becoming more difficult to accurately simulate gigabit interconnects with traditional Spice models.
To address this, Spice tools are increasingly supporting S-parameter simulation.
To support this need, Tektronix has added to IConnect the ability to output two- and four-port S-parameter data in the highly portable Touchstone file format, enabling design engineers to easily include S-parameters in simulations.
With high speed serial interfaces, analyses of connectors and cable assemblies are becoming increasingly sophisticated.
IConnect now provides the ability to generate an eye diagram including crosstalk effects for a passive interconnect link.
This allows the designer to quickly perform compliance testing of passive physical layer devices, such as cable assemblies and backplanes, eliminating the need for a VNA (vector network analyser) and a pattern generator to obtain this information, saving both equipment costs and test time.
"IConnect version 3.6 is an efficient, easy-to-use and cost-effective solution for design engineers who need to accurately characterise very high-speed serial data", said John Taggart, General Manager, Electrical Optical Product Line, Tektronix.
"With the additional capabilities in IConnect 3.6, our customers will benefit from the leading test software running on the industry's most capable sampling oscilloscopes".
"The combination provides engineers with state-of-the-art technology that is also tens of thousands of dollars less expensive than competing solutions".
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