Ericsson spinoff bases 3G design on TI baseband

Ericsson has selected Texas Instruments' baseband technology for its 2.5 and 3G Ericsson Mobile Platforms solutions following a memorandum of understanding between the two companies.

Ericsson has selected Texas Instruments' baseband technology for its 2.5 and 3G Ericsson Mobile Platforms solutions following a memorandum of understanding between the two companies.

Ericsson plans to combine its platform reference design and software with TI's semiconductors as part of Ericsson Mobile Platforms strategy to offer complete system solutions to the mobile phone and wireless devices industry.

"Today's announcement extends the deployment of Ericsson's and TI's industry-leading baseband technologies", said Tord Wingren, President of Ericsson Mobile Platforms.

"TI's wireless digital signal processor and analogue products and proven semiconductor manufacturing have enabled superior performance in Ericsson phones for more than a decade.

By being the first to create a company offering one of the broadest technology portfolios to all customers, Ericsson accelerates the next generation wireless market kick-off", he added.

Ericsson Mobile Platforms will support all major next-generation wireless standards including GSM/GPRS, 3G EDGE and WCDMA.

The new company's reference designs will offer complete component specifications, PCB layout, software and full IOT (InterOperability Test) enabling highest levels of integration, performance and power efficiency, key requirements for 2.5 and 3G wireless terminals.

Ericsson Mobile Platforms will leverage its own systems integration expertise along with TI's semiconductor solutions, allowing handset and other wireless device manufacturers to bring their products to market faster.

Ericsson Mobile Platforms' customers will also benefit from Ericsson's strong technology position for 3G mobile terminals.

With TI as its strategic semiconductor supplier, Ericsson Mobile Platforms will have access to TI's portfolio of "antenna-to-applications" solutions, including DSP-based digital baseband, analogue and RF devices, as well as OMAP application processing solutions.

"We are pleased to extend our relationship with Ericsson by contributing to Ericsson Mobile Platforms' complete wireless system solutions", said Gilles Delfassy, TI senior vice president and general manager for TI's Wireless Business Unit.

"Ericsson's new strategy to offer wireless complete solutions is another opportunity to accelerate the 2.5 and 3G market".

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