Product category:
Communications ICs (Wired)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: Comverse
Edited by the Electronicstalk Editorial
Team on 01 February 2002
Enhanced messaging added to OMAP
platform
Comverse's world leading enhanced messaging services will now operate on TI's high-performance and power-efficient OMAP platform for 2.5G and 3G wireless devices.
Comverse's world leading enhanced messaging services will now operate on TI's high-performance and power-efficient OMAP platform for 2.5G and 3G wireless devices By combining Comverse's open IP-based enhanced services platform with TI's OMAP processors, wireless device manufacturers and operators are expected to significantly reduce the deployment time of key applications such as mobile e-mail, multimedia messaging (MMS), instant messaging, as well as Comverse's mobile entertainment services
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
Related stories
Data buffer has dual multiplexer
Texas Instruments has introduced the industry's first 0- to 4-Gbps data buffer/signal conditioner with a dual multiplexer.
Reference design for wireless optical comms
A new technology from Texas Instruments dramatically cuts the cost and complexity of bringing the high-speed datarates of optical networking to end users.
Mobile multimedia e-mail will be presented at 3GSM World Congress, Cannes, 19th-22nd February, at Comverse's booth (Hall1, C24), and will be running on the OMAP platform at TI's Developers Village booth (Hall 4, K10).
"Enhanced messaging is clearly a key application area for both current and next-generation networks, and Comverse has the complete suite of multimodal messaging solutions which take full advantage of combining data, voice and rich media", stated Benny Einhorn, Chief Marketing Officer for Comverse.
"TI's OMAP platform helps to drive audio, voice and video content for multimedia-rich messaging services for 2.5G and 3G wireless devices.
Further reading
TI adds low-cost and high-integration DSP pair
Texas Instruments has unveiled the latest pair of programmable DSPs in its ultra-power-efficient TMS320C55x family of digital signal processors.
Triple-output power modules shrink ADSL designs
Texas Instruments has unveiled two new triple-output plug-in power solutions for asymmetric digital subscriber line (ADSL) applications.
Collaborating with TI will aid consumers, network operators, and handset vendors in benefiting from the tightest integration of end-to-end solutions".
"We are very excited that Comverse and TI are working together to optimise advanced 2.5G and 3G mobile services for the OMAP platform", said Alain Mutricy, TI Vice President, worldwide OMAP platform General Manager.
"By combining both Comverse's and TI's complementary expertise, we will significantly accelerate the deployment of multimedia enhanced services and advanced mobile applications".
By combining their complementary expertise Comverse and TI will quickly deliver key wireless messaging services and further accelerate the demand for advanced mobile devices.
As part of the collaboration, Comverse has become a member of TI's OMAP Developer Network, a group of companies writing wireless applications for mobile information devices.
OMAP developers enjoy a variety of tools and support to enable rapid application development for leading operating systems and programming languages plus the opportunity to collaborate with a range of developers designing applications such as multimedia, security, location based services, advanced speech technology, mobile commerce and gaming.
In addition, TI has become a member of the Comverse Spark Alliance Programme, which promotes cooperation in the development, marketing and delivery of multimedia communication solutions.
By teaming with innovative partners, Comverse integrates the latest technologies, applications and content into existing and new Comverse products.
• Texas Instruments (April 2001-March 2006): contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

