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News Release from: Texas Instruments (April 2001-March 2006) | Subject: TNETV3010 bundled solution
Edited by the Electronicstalk Editorial
Team on 12 April 2002
TI TNETV3010 set to lead in VoP
In a new development, the TI TNETV3010 and WinPath have been combined to offer optimal channel densities by leveraging the strengths of each device
WinPath, the first access packet processor, has been integrated with the TI TNETV3010 high-density gateway to provide an integrated reference architecture for the VoP market The announcement from Texas Instruments and Wintegra means that telecom equipment manufacturers of VoP systems now have available a fully programmable platform
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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TI says the TNETV3010 leverages its VoP expertise and leadership to enable the highest solution density in the VoP market.
Built on TI's TMS320C55x DSP core and field-hardened Telogy Software products, the TNETV3010 provides the lowest power per G.711 channel and a full complement of carrier class features that includes the most complete set of audio codecs in the industry.
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The TNETV3010 supports voice processing functionality in the reference architecture, including G.168-2000 compliant echo cancellation with a 128ms echo tail, tone detection and generation, audio transcoding, and full VoP packet/cell encapsulation.
The WinPath receives complete packets/cells from the TNETV3010 and provides cell, packet and AAL2 CID (ATM Adaptation Layer 2 configuration installation and distribution) switching, L2-L7 classification, AAL2 CPS (characters per second) packing and unpacking, protocol interworking and traffic management.
The WinPath can also support host signalling and administrative functions.
The support for standards-based interfaces on the TNETV3010 and WinPath allows for tight integration without the need for additional glue logic.
"We are very pleased to be working with Wintegra on a high-density reference architecture that delivers the channel density and "carrier class" features that customers demand, with a power consumption that fits in well below most power budgets", said Brian Glinsman, executive director of marketing of TI's VoIP Business Unit.
"The TNETV3010 and WinPath are complementary in this reference architecture, the TNETV3010 allowing customers the scalability and flexibility to support numerous voice and signal processing features, and the WinPath providing the flexibility to handle multiple network protocol and switching requirements.
The end result is a solution that achieves optimal channel densities by leveraging the strengths of each device".
The reference architecture represents the continuing collaboration between TI and Wintegra after announcing a business relationship in April 2001.
The WinPath processor family was introduced with customer sampling in November 2001, specifically targeting access infrastructure devices such as high density gateways, and is the first highly integrated processor to feature more than 18 data and control path functions on-chip.
This array of protocols is key to WinPath's ability to provide packet switching and protocol conversion and hosting signalling and administrative functions in conjunction with the TNETV3010's voice processing and VoP packet/cell encapsulation as part of the reference architecture's exclusive features.
"The TI/Wintegra reference architecture is the industry's first instance of a fully programmable DSP, data path and control path solution that offers unmatched ATM and IP performance.
To be partnered with a leader in VoP technology such as TI is important to our customers.
This relationship is a fine example of a unique technology collaboration that benefits the VoP industry, and is a striking demonstration of the complementary functions our two companies are able to deliver", said Kobi Ben-Zvi, Wintegra's President and CEO.
The scalability of the WinPath and TNETV3000 families to address low to high channel density applications - from DS-3 to OC-12 - is key to designing in solutions that make sense for today's equipment operators".
TI will offer a TI/Telogy TNETV3010 bundled solution for the TI/Wintegra high-density reference architecture.
TI will also offer an OC-3 evaluation module for customer development purposes.
The TI evaluation module includes hardware, schematics and design documents.
General availability of the TNETV3010 bundled solution and evaluation module for the reference architecture is expected in 4Q 2002.
The TNETV3010 is sampling in quantity today with full production planned in 1Q 2003.
The WinPath family is available today and will begin full production in 2Q02.
(Updated by CR, May 2007).
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