Product category:
Standard Logic Devices
News Release from: Texas Instruments (April 2001-March 2006) | Subject: AUC Widebus logic
Edited by the Electronicstalk Editorial
Team on 23 May 2002
Even smaller package for lov-voltage
logic family
Texas Instruments has released its Advanced Ultra-Low Voltage CMOS (AUC) logic technology.
Texas Instruments has released its Advanced Ultra-Low Voltage CMOS (AUC) logic technology, which provides significant benefits to communications, computing and telecomms applications by operating at low power and high speed while maintaining overall system signal integrity The AUC Widebus family, which is available in TI's MicroStar Jr packaging technology, a very fine pitch ball grid array (VFBGA) package, is the first logic family optimised at 1.8V, and has an operating voltage range of 0.8 to 2.5V with a voltage tolerance of 3.3V
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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This mixed-voltage operation extends the life of systems by allowing legacy devices, operating up to 3.3V, to interface with AUC Logic.
The Ioff feature of the family protects the device by supporting partial power-down applications.
"By providing customers with leading technologies and innovative products, TI continues to reinforce its commitment to the logic market.
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The introduction of AUC Widebus devices in our MicroStar Jr BGA package enables customers to gain higher performance and board real estate as they migrate their designs to lower operating voltages and smaller form factors", said David Hoover, worldwide product marketing manager for TI's Standard Linear and Logic Products.
Targeted for telecommunications and computing applications, the AUC Widebus devices offer high-speed data throughput and enhanced signal integrity that is critical to performance.
The typical propagation delay for the Widebus devices is a fast, 2.0ns (max) at 1.8V.
The optimised operating voltage of 1.8V provides a seamless logic migration for systems currently operating at 3.3V.
TI has been working closely with Philips and IDT to define the specifications for the new AUC family.
Both IDT and Philips plan to release VFBGA Widebus devices in 2002, ensuring that alternate sources are in place for the AUC Widebus technology in BGA packaging.
"IDT is committed to deliver AUC logic, the next-generation logic standard which will offer a wide range of operation, superior performance and innovative packaging to address the design challenges of our networking and communications customers", said Kevin Walsh, director of strategic marketing for IDT's Timing and Logic Division.
"Working with TI and others in the development of AUC ensures that our customers are assured that next generation logic technology is always present in the marketplace and is available to assist designs in reaching their full capabilities", stated Bruce Potvin, director of marketing, Business Line Logic in the Semiconductor Division of Philips.
With a footprint of 31.5mm2 and a height of 1mm, the VFBGA package allows for reduced board space in applications such as base stations, networking systems, and PCs.
MicroStar Jr is 70-75% smaller than the industry standard TSSOP (thin scale small outline) package.
Another advantage the MicroStar Jr has over other competitive packages is the ball pitch of 0.65mm.
Due to shorter wire lengths/internal traces, the 0.65mm ball pitch VFBGA offers a 30% performance (inductance) improvement over the 56-ball BGA with 0.8mm ball pitch, as well as a 40% space savings over the same package.
Volume production for the first Widebus devices in the AUC family are scheduled for the second quarter of 2002.
Widebus devices are available in MicroStar Jr BGA (GQL), TVSOP (DGV), and TSSOP (DGG) packaging.
The AUC family is fully supported with technical documentation.
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