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Communications ICs (Wired)
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial
Team on 04 November 2003
Open environment to cut cost of mobile
Java
Sun Microsystems and TI are working together to deliver optimised end-to-end wireless solutions for 2.5G and 3G networks.
Sun Microsystems and TI are working together to deliver optimised end-to-end wireless solutions for 2.5G and 3G networks The initiative marks the beginning of a collaboration that will help increase demand for converged voice and multimedia wireless devices, creating revenue-generating opportunities for OEMs, wireless operators and applications developers
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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"Widespread deployment of compelling new applications based on open standards-based platforms will drive consumer demand for 2.5G and 3G wireless handsets and services", said Rick Kornfeld, Vice President and General Manager of TI's Wireless Chipset Business Unit.
"We are pleased to work with Sun to accelerate the growth of the wireless market via complete, end-to-end Java solutions and optimised Java technology for TI's TCS wireless chipsets and OMAP applications processors".
As part of this collaboration, TI licensed Sun's Connected Limited Device Configuration HotSpot Implementation (CLDC HI) for integration into its family of TCS chipsets for GSM/GPRS, Edge, CDMA and UMTS-enabled handsets and wireless OMAP applications processors in an effort to reduce the complexity of Java technology-enabled handset production and to ensure an enhanced consumer experience.
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TI expects to offer complete GPRS chipsets and handset reference designs including Sun's CLDC HI by the second quarter of 2004.
Sun and TI also are working together to provide an optimised implementation of Mobile Information Device Profile 2.0 (MIDP 2.0) on TI's TCS wireless chipsets and OMAP processors.
These joint efforts will simplify the design of optimised, Java technology-enabled devices, thus reducing development costs and time-to-market for mobile device manufacturers.
The optimised implementation of MIDP 2.0 that interoperates with CLDC HI on TI's OMAP platform is expected to be available from Sun by the second quarter of 2004.
The two companies plan to validate the optimised Java implementation on the OMAP platform with Sun's Content Delivery Server to reduce the complexity for mobile operators in the deployment of Java technology-based mobile data services.
The combination of Sun's Java Mobility Advantage Program and the Sun Content Delivery Server with TI's TCS wireless chipsets, OMAP application processors and reference designs will provide a high performance, integrated, end-to-end solution for the deployment of Java applications and services.
"Mobile device manufacturers and wireless operators recognise Java as a leading technology that delivers value in the development and deployment of mobile data services.
Together, Sun and TI will provide new revenue-generating opportunities for OEMs, wireless operators and developers by enabling a broad range of Java applications and content to accelerate the deployment of Java technology-enabled handsets and services", said Alan Brenner, Vice President of Sun's Consumer and Mobile Systems Group.
"Beyond this collaboration, we plan to work with TI on future projects that will enable more exciting Java content across different handset markets".
Sun has recently announced that the shipment of mobile Java devices exceeded the 120 million-unit milestone.
Factors contributing to this milestone include the availability of more than 200 different Java technology-enabled handsets through more than 70 carriers worldwide, a growth of 35% since June.
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