Product category:
Analogue and Mixed Signal ICs
News Release from: Texas Instruments (April 2001-March 2006) | Subject: Components for wireless basestations
Edited by the Electronicstalk Editorial
Team on 16 February 2004
Focus on basestations in Cannes
Texas Instruments will feature several new devices for wireless infrastructure basestation manufacturers at the 3GSM World Congress.
Enhancing its already broad portfolio of analogue and digital signal processing products for wireless infrastructure basestation manufacturers, Texas Instruments will feature several new devices spanning the signal chain from the antenna to the network at the 3GSM World Congress These products are expected to enhance infrastructure systems dramatically, ultimately enabling cellular phone users to receive voice and data calls in more ways and with better service
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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Combined, these factors are spurring system providers toward cost effective, flexible and complete solutions that help minimise capital and operating expenditures Leveraging its significant experience with wireless infrastructure customers, TI has responded to these market factors by developing high performance products which provide greater channel density, increased system flexibility and enable customers to get to market faster.
"TI is in the sweet spot of a wireless infrastructure market that is approaching a crucial time in its history", said Jerold Givens, Manager of TI's Wireless Infrastructure DSP Group.
"We continue to translate our increasing system knowledge into the right products that will enable networks to deliver feature-rich services consumers want".
TI's digital signal processor (DSP) optimised for wireless infrastructure - TMS320TCI100 - is now available in 720MHz at the 90nm process node.
Along with an extremely power efficient core (600mW), this device also supports integrated Viterbi and Turbo coprocessors, supporting over 600 voice channels (7.95Kbit/s AMR) and 35 data channels (384Kbit/s), respectively.
When combined with the TCI110 and 120 receive and transmit accelerators, this device provides an optimised solution for WCDMA.
In addition to the performance improvements this device brings to 3G basestations, it also handles all baseband processing for two GSM/Edge carriers, with ample overhead.
A complete set of tools and software are also available, reducing the infrastructure network manufacturer's total cost of ownership while accelerating time to market.
Combining the optimised TMS320TCI100 solution with TI's high density, field hardened voice over packet (VoP) gateway solutions address the tough challenges facing service providers deploying packet-based networks.
Designed with an emphasis on solution density, they address solution architecture, channel density, power per channel, and carrier class features to deliver a complete solution.
This high performance solution increases the number of GSM adaptive multirate (AMR) speech coding channels to 41 - offering improvements over the previous solutions.
TI also provides customers the capability to develop a true system on a chip using state-of-the-art ASIC manufacturing process and highly differentiated intellectual property, including high-speed serial links and several DSP cores.
The 14bit, 125Msample/s ADS5500 analogue to digital convertor and the 16bit, 500Msample/s DAC5686 are only two of the latest high performance additions which have been made to the robust portfolio of analogue products from TI.
The ADS5500 delivers breakthrough receiver performance - SNR of 70dB and SFDR of 82dB at 100MHz IF - at the lowest power.
This allows accurate reception of weaker, distant signals, up to 190MHz.
As a result, basestations can process multiple carriers in a single radio chain, reducing the total system cost and number of analogue components.
"With the additions of our recent high performance analogue products, TI is strongly positioning itself to offer one-stop shopping for the entire transceiver card - data convertors, up/down convertors, serdes devices, connectivity, clocking, logic and power management", said Kent Novak, Manager for TI's Analog Wireless Infrastructure Business Unit.
"In addition, we will be enhancing this broad portfolio with several RF products in the first half of this year, giving customers even greater choices for both high performance and low cost systems".
As a dual data convertor, the DAC5686 provides superior ACPR performance at high IF while providing customers with flexible, programmable options using three modes of operation and integrated digital functions.
It supports up to four WCDMA or cdma2000 carriers and requires 50% less power than competitive products.
The programmable digital down or up convertor, GC5016, accepts inputs from ADS5500 in receive mode or provides output data to the DAC5686 in transmit mode.
It can also be used in transceiver mode to provide single chip digital down convertor and digital up convertor functionality for single carrier applications such as picocell basestations and repeaters.
Debuting this quarter will be the GC5316 targeting higher density, multicarrier applications.
This new down/up convertor handles up to 24 cdma2000 or 12 WCDMA channels.
It can also be configured to support mixed standard operations such as cdma2000 and WCDMA using a single chip.
The device is expected to be released to production in Q2 of 2004.
Completing the signal chain for the transceiver card is a family of operational amplifiers including the THS4271 high-speed operational amplifier, which delivers ultralow distortion with ultralow noise.
Several timing devices are also available, including the CDC7005, TI's new low-phase-noise clock synthesiser, which provides multiplying, dividing and jitter cleaning for optimal timing performance.
TI will also be releasing to production a family of high performance RF products which are targeted at infrastructure systems.
TI's TLK family of serialiser/deserialiser devices support data rates from 500Mbit/s to 2.5Gbit/s with low power dissipation and built-in high-speed equalisation which allows for greater signal integrity in long links.
With its advanced CMOS technology and expertise in high-speed serial and parallel I/O, this technology gives customers the ability to increase the port density of existing systems without having to replace legacy backplanes.
Also, TI recently announced a 6.25Gbit/s serial link capability that provides customers an upgrade path to 6Gbit/s transmission over legacy system backplanes.
Although much of the basestation manufacturer's focus is on the core components of the signal chain, flexible, high performance supporting products can provide significant improvements in system efficiency.
As the leader in logic, TI applies its CMOS technology to the AUP and AUC low power and high speed families ideal for wireless applications.
Also available are both high-drive (100mA) GTLP devices for heavily loaded backplanes as well as medium drive devices (50mA).
The CBT, CB3Q, CB3T and CBTLV families of bus switches offer designers a broad portfolio to meet their switching needs.
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