Product category:
Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TNETW1250 and TNETW3422M
Edited by the Electronicstalk Editorial
Team on 24 March 2004
Wi-Fi chipset shrinks for handset
deployment
Texas Instruments has unveiled its third-generation 802.11 solution specifically designed for mobile devices such as cellphones, smartphones and PDAs.
Texas Instruments has unveiled its third-generation 802.11 solution specifically designed for mobile devices such as cellphones, smartphones and PDAs With cellphones and mobile devices becoming the prevailing communication and entertainment devices for consumers, Wi-Fi connectivity provides faster speeds so consumers can download more information, photos and music more quickly
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The new chipset can be configured for 802.11b/g or 802.11a/b/g operation using different WLAN RF solutions from TI.
It offers manufacturers unparalleled size, power and cost reductions, and takes battery savings to the next level, adding dramatic increases in active time.
The chipset leverages two previous generations of deployed mobile WLAN chipsets, as well as TI's expertise in cellular, Bluetooth and coexistence platforms.
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The two-chip 802.11b/g solution combines the TNETW1250 single-chip MAC/baseband processor with the TNETW3422M radio frequency front end (RFFE) and power amplifier chip.
This platform provides more than 50% reduction in board size compared with TI's previous 802.11 mobile chipset.
The design also uses 25% less board area than competing solutions.
By focusing on manufacturers' system-level design needs for handsets, TI has laid the groundwork for a highly optimised dual-mode handset.
The TNETW1250 chipset has been designed to be used with TI's OMAP application processors, GSM, GPRS, CDMA and Edge chipsets and single-chip Bluetooth solution.
Architecture innovations in the TNETW1250 such as on-chip power management, re-use of cellular clock frequencies, and low-pin-count host interfaces were included to eliminate barriers for integration of WLAN into cellular handset designs.
"TI was one of the very first companies to recognise and address Wi-Fi requirements for very small form factors such as cellphones two years ago.
TI continues to draw on its wireless expertise and innovation, providing ultra-low-power compact solutions that will help to shape the WLAN mobile device market", said Aaron Vance, Senior Analyst, Synergy Research Group.
"With its diversified portfolio of dual-band WLAN chipsets, OMAP application processors, Bluetooth and VoIP leadership, TI has drawn an extremely viable blueprint for Wi-Fi's future in cellphones".
Through TI's ELP technology for low-power standby modes, the TNETW1250 offers the industry's best sub-400uA standby power consumption, which has been highly optimised through TI's extensive mobile product experience.
With 50% power reduction in active modes, the TNETW1250 is designed for real world cellphone applications including VoWLAN, streaming media and fast roaming between access points.
For additional power reduction, the host processor is only used for transmit and receive functions, allowing it to stay in a low power mode to increase battery savings at the system level.
"2004 is expected to be a pivotal year for Wi-Fi enabled portable devices, as more 802.11-enabled cell phones and PDAs hit the market", said Marc Cetto, General Manager of TI's Mobile Connectivity Solutions.
"Today, several companies are offering phones and PDAs using TI's 802.11b mobile solutions.
The TNETW1250 platform will allow manufacturers to quickly deploy new 802.11a/b/g-enabled mobile devices that are smaller and offer maximum battery life".
In addition to size and power reductions, the TNETW1250 offers unmatched cost savings and easier design for cell phone manufacturers.
The 70% reduction in system-level chip count provides a significant decrease in the bill of materials (BOM) reducing board and design complexity.
The TNETW1250 supports all security and quality of service standards including WPA2 and WME, eliminating further design time for manufacturers.
Accompanying the TNETW1250, the TNETW3422M is a highly optimised 2.4GHz single-chip RF transceiver and power amplifier.
This radio, which uses direct-conversion architecture, is ideal for use in a cellular handset for size, cost and power consumption advantages.
Also, the absence of intermediate frequency noise enables much simpler RF planning inside the complex environment of a cellphone.
To address the migration of TI's mobile WLAN customers from the TNETW1230 and TNETW1100B, TI will continue to leverage its modular embedded station developer's kit (eSTADK).
The eSTADK was designed to meet the unique requirements of the mobile embedded market and includes programming and hardware design tools, as well as sample reference designs to streamline the development process and accelerate customised designs.
The chipset is expected to be in production by mid-2004.
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