Product category:
Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TD-SCDMA chipset solution
Edited by the Electronicstalk Editorial
Team on 17 November 2004
TD-SCDMA chipset supports complex 3G
applications
Commit hand TI have developed a flexible TD-SCDMA chipset solution easily customised for supporting complex 3G applications.
Commit, a research and development joint venture with Chinese communications equipment manufacturers and Texas Instruments are driving 3G wireless innovation in Asia, providing the Chinese wireless industry with a flexible TD-SCDMA chipset solution easily customised for supporting complex 3G applications The TI and Commit solution incorporates TI's OMAP multimedia processors and digital signal processing (DSP) technology
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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TI and Commit are demonstrating a 3G TD-SCDMA prototype handset developed by one of its customers, which includes TI's OMAP processor and tested with various infrastructure partners, during the 3G World Congress this week in Hong Kong.
Working together to drive 3G growth in China, the TI and Commit chipset provides an open, trusted alternative chipset solution to the Chinese wireless industry, which until recently has been dependent on imported technology.
Locally designed to support TD-SCDMA, the "home grown" 3G standard for China, the Commit and TI chipset solution enables handset manufacturers to dramatically shorten their time to market, thus speeding up the industrialisation process of the 3G TD-SCDMA industry.
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TD-SCDMA is becoming an important technology for Asian operators for both their current and evolving networks in order to support efficient high-speed packet data services.
Commit recently announced its complete chipset solution and architecture for TD-SCDMA terminals integrating TI technology, including the RF, analogue baseband and digital baseband chip, TI's OMAP processor, and its protocol stack software, which support the TD-SCDMA voice and data requirement.
The complete chipset solution will be ready for mass production in 2005.
Handset manufacturers such as LG, Bird and DBTel are already developing TD-SCDMA terminals based on the TI and Commit chipset solution.
As of today, Commit is the only company currently offering a complete chipset solution for TD-SCDMA terminals, allowing Commit to better manage evolving product requirements and to control the cost and the performance of the total solution.
TI is one of several major industry players working with COMMIT to drive 3G TD-SCDMA growth in China, including China Putian, China Academy of Telecommunications Technology, LG Electronics and DBTel.
TI's leadership in 3G is reflected in the numbers: six of the top seven worldwide 3G handset manufacturers use TI's modems, OMAP processors, or both, including analogue.
TI also provides infrastructure technology to nine of the top 10 basestation OEMs, capturing 90% market share in 3G.
In addition, TI has optimised DSP and analogue solutions for TD-SCDMA deployments, including a newly announced 850MHz processor core and analogue data convertors.
"3G is picking up steam around the globe, and China is no exception?, said Gerald Kuo, TI China Managing Director.
"TI's wireless systems know-how drives significant value for TI customers in the form of hardware and software solutions designed specifically for the wireless environment, including 3G".
"Through the co-operation between Commit and TI, Commit is able to provide a complete TD-SCDMA terminal solution compliant with 3GPP standards".
"This will be a driving force to promote TD-SCDMA in the worldwide 3G market?.
"Commit's chipset solution will speed up the commercialisation of TD-SCDMA phones?, said Dr Xiongqiang Tao, Chairman of the TD-SCDMA industry alliance and Commit board of directors.
"Because of TI's wireless systems knowhow and through our close co-operation with handset manufacturers and infrastructure vendors during the research and development phase, this new TD-SCDMA chipset solution can better satisfy customer requirements and interoperate with various infrastructures, which should accelerate the Commit solution launch to market?.
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