Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TMS320TCI100Q
Edited by the Electronicstalk Editorial
Team on 18 November 2004
DSP boosts 3G basestation performance
The TMS320TCI100Q is claimed to be the industry's highest-speed DSP optimised for basestation manufacturers deploying 3G networks such as TD-SCDMA for the booming China market.
Pushing the envelope for wireless infrastructure bandwidth, Texas Instruments has released the industry's highest-speed digital signal processor (DSP) optimised for basestation manufacturers deploying 3G networks such as TD-SCDMA for the booming China market TD-SCDMA is a China-backed 3G wireless technology adopted by the International Telecommunication Union (ITU) for 3G standards as well as the Universal Mobile Telecommunications System (UMTS)
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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Additionally, for TD-SCDMA baseband processing, this product can reduce the number of processors for a full carrier from three to two.
Improvements have also been made in power management, with the device operating at a cool 2W, reducing the overall power per channel by 20%.
With the lowest power per channel in the market, TI's latest DSP is also highly beneficial for GSM/Edge and UMTS transceiving applications as well as for transcoding/media gateway designs.
The TCI100Q is the newest member of TI's wireless-infrastructure-optimised processors, and is also compatible with TI's TMS320C6000T family of DSPs.
It offers higher system integration with the added boost of Viterbi and Turbo coprocessors.
Code compatible with all current and future TCI and C6000T family products, the TCI100Q gives OEMs an indispensable tool for creating new revenue opportunities in their markets.
"With 9 out of the top 10 basestation OEMs using our solutions for 3G networks, TI has developed a compelling portfolio of products designed to give the customer maximum flexibility", said Jerold Givens, Business Unit Manager of Wireless Infrastructure DSP at TI.
"With the addition of the 850MHz product, manufacturers can now choose which solution best meets their needs for specific air interface deployments and network conditions".
"We know that consumer demand for increased bandwidth will continue to grow, and we will continue to push the power-performance envelope in our next generation of products".
As the wireless industry experiences explosive growth in China, Japan and South Korea, and as the USA adopts next generation networks, the TCI100Q offers OEMs upgrades across multiple air interfaces.
For GSM/Edge baseband processing and UMTS symbol rate processing, the 850MHz device offers an 18% improvement in performance over the current 720MHz option, and delivers added room for more channels or added features.
And for transcoding/media gateway applications, the TCI100Q supports up to 48 NB AMR channels, up from 41 channels with the 720MHz version, allowing for improved system density.
In addition to the benefits of the new device, only TI delivers a complete signal chain solution for wireless infrastructure OEMs.
Developed over 20 years in the wireless market, TI's end-to-end approach allows customer to save development time and dollars that are better spent creating differentiated products and services.
In addition to the speediest, highest performing silicon, TI offers complementary high performance analog parts that are optimised for the wireless market, including cutting-edge analog/digital convertors.
OEMs also have access to TI's third parties in our 500+ member network who have developed unique code optimised for specific air interfaces.
Further simplifying the design process, TI offers customers software libraries as well as TI's proprietary development tool, Code Composer StudioT (CC Studio).
With CC Studio, designers working on the TCI100Q can take advantage of a development environment that integrates all the familiar PC host tools needed to take a real-time, embedded application quickly through the design process.
This high level of integration allows DSP designers of all experience levels complete access from beginning to end of development and gets products to market fast.
The TMS320TCI100Q, TI's first WI DSP manufactured on its leading edge 90nm high-performance process, was released to production in September 2004, and samples and production are available now.
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