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Product category: Embedded Software and Operating Systems
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial Team on 17 February 2005

Protocol stack to enhance Bluetooth
offerings

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Texas Instruments has enhanced its Bluetooth technology portfolio by licensing the Bluetooth protocol stack and profiles suite from Extended Systems.

Texas Instruments has enhanced its Bluetooth technology portfolio by licensing the Bluetooth protocol stack and profiles suite from Extended Systems, a leading provider of mobile application solutions TI now offers its mobile terminal customers a complete range of single-chip mobile connectivity solutions and software components for Bluetooth personal area networking

Additionally, TI will offer a pre-integrated Bluetooth protocol stack with its cellular systems solutions to speed time to market of new Bluetooth-enabled mobile phones.

"TI continues to be a leader in Bluetooth solutions for mobile phones".

"TI's Bluetooth single-chip DRP technology solutions deliver high-performance Bluetooth wireless networking with the low-power, small size and low cost required for 2.5G and 3G mobile terminals", said Marc Cetto, General Manager, TI's Mobile Connectivity Solutions.

"Licensing Extended Systems' leading Bluetooth protocol stack and profiles ensures we can provide the most complete and robust hardware and software solutions to our customers, speeding their time to market and reducing their development costs".

The Bluetooth protocol stack will be offered with TI's single-chip Bluetooth solutions for mobile terminal platforms, including the BRF6300, the first Bluetooth single chip using advanced 90nm CMOS technology.

TI is uniquely positioned to provide further integration and innovation for Bluetooth-enabled mobile terminals with more than 15 years of expertise in cellular systems and a hardware and software Bluetooth technology portfolio.

The first introduction of the Bluetooth protocol stack integrated with a TI cellular platform will be with TI's next generation Edge chipset, the OMAPV1030, an enhanced, cost-efficient Edge solution enabling handset manufacturers to bring advanced multimedia features to the growing mid-range wireless market.

This will be followed by additional chipset solutions for 3G mobile terminals.

"Extended Systems has more than seven years of Bluetooth experience which it has used to develop one of the leading Bluetooth protocol stacks for cellular platforms".

"TI is now able to take this expertise to complete its Bluetooth product offering", said Chuck Jepson, President and CEO of Extended Systems.

"Extended Systems' Bluetooth protocol stack and profiles suite enhances TI's leading single-chip Bluetooth platforms to provide complete system solutions for mobile terminal OEMs and ODMs worldwide".

Texas Instruments (April 2001-March 2006): contact details and other news
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