Product category:
Design and Development Hardware
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TSW3000 EVM
Edited by the Electronicstalk Editorial
Team on 30 September 2005
Evaluation kit speeds basestation
development
An easy-to-use RF transmit signal chain demonstration kit speeds time to market by cutting development time, risk and cost in wireless infrastructure applications.
Texas Instruments has introduced an easy-to-use radio frequency (RF) transmit signal chain demonstration kit that speeds time to market by cutting development time, risk and cost in wireless infrastructure (WI) applications The demonstration kit provides a complete RF transmitter from digital baseband to analogue RF, addressing the RF transmission needs of wireless basestation or fixed wireless access equipment across all of today's wireless communication standards
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The TSW3000 evaluation module (EVM) combines: the DAC5687 16bit, 500Msample/s interpolating digital-to-analogue convertor (DAC); the CDCM7005 low-phase-noise, low-jitter clock synthesiser and jitter cleaner; the TRF3702 low-noise direct quadrature modulator; and the TRF3750 high-performance, monolithic phase-locked loop (PLL) frequency synthesiser.
Designers can use the kit as a working high-performance transmitter front-end chipset, as a tool to evaluate individual components' performance in an actual transmitter or as a means to verify system performance at the RF signal without incurring additional engineering costs.
The chipset minimises noise and distortion, which are key performance issues in WI applications.
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When interfaced with the TRF3702 in-phase/quadrature (I/Q) modulator, the IQ compensation feature of the DAC5687 allows optimisation of phase, gain and DC offset to maximise carrier suppression and sideband rejection, while maximising power to the modulator.
This, in turn, results in an excellent adjacent channel power ratio (ACPR) of 71dB in a single-carrier WCDMA application at 30.72MHz intermediate frequency (IF) with a RF local oscillator (LO) of 2.14GHz.
In a two-carrier WCDMA application, the chipset delivers an ACPR of 65dB at 92.16MHz IF with an RF LO of 2.14GHz.
In addition, the TSW3000 features I/Q modulation from 1.5 to 2.5GHz.
The TSW3000 provides a design solution that would otherwise cost WI basestation manufacturers thousands of dollars in parts and labour and several months of design time.
In addition, since all the components are manufactured and supported by TI, designers who use the kit as the basis for a reference design can enjoy one-stop shopping and take full advantage of TI's systems expertise and complete array of products, tools and technical support for high-speed designs.
The TSW3000 joins other TI tools and solutions for basestation designers, including the GC5016 system evaluation kit (GC5016SEK) for evaluating TI's wideband quad digital down-convertor/up-convertor, and the TSW1100 data capture card and software for evaluating the company's WI-optimised high-speed analogue-to-digital convertors.
TI also offers a strong line of high performance, low power digital signal processors optimised for wireless infrastructure applications.
TI is the only semiconductor provider to offer a complete signal chain solution, and nine of the top 10 3G basestation OEMs use TI technology.
The TSW3000 is available today from TI.
The price of $499 includes the EVM, user's guide, software, termination resistors, datasheet for each component, power supply and parallel port cable.
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