Product category:
Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TCS2010
Edited by the Electronicstalk Editorial
Team on 19 October 2005
Chinese manufacturer finds low-cost
route to 2.5G
TI's 2.5G wireless platform is being used by leading Chinese manufacturer TCL Communication Technology for developing affordable 2.5G handsets.
Advancing its commitment to fuel growth in emerging markets worldwide by providing wireless solutions for low-cost handsets, Texas Instruments has announced that its 2.5G wireless platform has been selected by leading Chinese manufacturer TCL Communication Technology (TCT) for developing affordable 2.5G handsets As part of its roadmap to address the growing requirement for low-cost handsets, TCT plans to leverage TI's 2.5G and DRP-based single-chip cellphone technology in its handsets
This article was originally published on Electronicstalk on 24 Feb 2003 at 8.00am (UK)
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The OT-E157 is the first in a series of handsets TCT will develop using TI's 2.5G solutions.
Announced in first quarter 2005 and expected to ship in volume in October, the OT-E157 is a voice-centric handset that will include popular features like basic messaging applications, polyphonic ring tones, an alarm clock and games.
Additionally, the device will retail at approximately US $40, an attractive price point required to drive mass adoption in low-cost markets.
"This first product results from close collaboration with TI, whose extensive wireless expertise enabled us to quickly design a low-cost handset where pricing is a critical ingredient in the recipe for success", said Liu Fei, CEO, TCT.
"With the selection of TI's 2.5G technology, we are establishing a relationship that will provide trendy, yet affordable wireless devices to rapidly-growing markets like China and Latin America".
TI's full Class 12 GSM/GPRS TCS2010 chipset will power the OT-E157.
Shipping in volume today, the TCS2010 allows manufacturers to achieve low system BOM while providing applications processing capabilities.
Additionally, the chipset incorporates power saving innovations that double standby time over previous-generation devices.
TCT's product roadmap also includes ultra-low-cost handsets based on TI's single-chip cellphone solution, which was announced in January and targets the mass-market voice-centric marketplace.
Developed using TI's DRP technology and advanced 90nm CMOS manufacturing process, the single-chip cellphone solution integrates the bulk of handset electronics onto a single chip, including digital baseband, SRAM, logic, RF, power management and analogue functions.
This pioneering approach to wireless chip design dramatically reduces cost, power requirements, board area and silicon area - critical factors for designing high-volume, entry-level mobile phones.
This innovative technology, sampling today, makes for a more cost-effective, powerful, versatile mobile phone for emerging markets like Asia, Latin America and Eastern Europe.
"TI's wireless technology is empowering people to connect, communicate and exchange information in places where it hasn't yet been possible", said Larry Tan, TI Vice President, Asia Marketing and Sales.
"Our cost-efficient solutions are enabling companies like TCT to build devices with the features and functionalities their customers want at prices they can afford".
The announcement underscores TI's commitment to provide low-cost solutions for emerging markets worldwide.
Drawing on more than 15 years of wireless systems expertise, TI is the worldwide leader in developing 2.5G wireless solutions.
The company's success is evident in the numbers.
Worldwide, more than 1.8 billion handsets have shipped with a TI digital baseband and 250+ million 2.5G cellular system chipsets have shipped to more than 35 customers.
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