Product category:
Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: DTV1000 and the DTV1001
Edited by the Electronicstalk Editorial
Team on 09 January 2006
Single-chip receivers cut handset TV
down to size
Broadcast digital TV can now be delivered into the cellphones of millions of consumers worldwide while maintaining low cost, long battery life and attractive phone size.
Broadcast digital TV can now be delivered into the cellphones of millions of consumers worldwide while maintaining low cost, long battery life and attractive phone size Initial Hollywood DTV single-chip solutions for mobile phones are now being delivered to TI's customers who manufacture handsets worldwide
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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TI's Hollywood chips are the first in the industry to integrate the mobile TV tuner and demodulator into one piece of silicon using standard 90nm digital process.
Consumers should expect to find the first mobile phones with TI's Hollywood chips inside on the market in late 2006.
"We've moved aggressively to provide consumers with the ability to experience Hollywood in the palm of their hands".
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"The Hollywood design team has made an extraordinary achievement - in less than three days the team was able to get initial silicon working and receiving digital TV content", said Gilles Delfassy, TI Senior Vice President and General Manager for TI's Wireless Terminals Business Unit.
"Mobile TV is expected to boost 3G adoption, much like camera phones did for the 2.5G market and add significant new revenue to both television broadcasters and mobile phone operators".
"Broadcast TV to the mobile phone is starting to find market traction worldwide; in order to integrate this function in the cellular handset, the solution needs to be small in form factor, low in power consumption, and low in cost".
"Typically TV functionality necessitates three individual chips to handle the RF, baseband, and memory portions; but the three constraints mentioned suggest that, vendors that offer an integrated single-chip solution will allow their handset partners a market-leading advantage", said Alan Varghese, Principal Analyst at ABI Research.
TI's first two products in the Hollywood mobile DTV family are the DTV1000 and the DTV1001.
As complete solutions, both chips enable mobile TV handsets and services to reach the mass market quickly and at a lower cost to consumers.
Hollywood chips support open industry standards, addressing the requirements of customers around the globe.
Primary standard support includes DVB-H which is being deployed world-wide including Europe, the U.S.
and parts of Asia, and ISDB-T which is being deployed in Japan.
DVB-H and ISDB-T use OFDM (orthogonal frequency division multiplexing) technology which provides good spectral efficiency and immunity to multi-path to offer improved mobile TV performance.
In addition, both the DTV1000 and the DTV1001 chips interface with TI's family of OMAP applications processors to deliver crisp, clear video and stereo audio, offering consumers the quality of a living room TV-viewing experience in the palm of their hand.
"Modeo congratulates TI on its continued development of its Hollywood product line, which signals a deep commitment to the mobile television market and is expected to provide a high performance, low cost solution for use in the delivery of quality mobile television and audio content to mobile devices", commented Michael Schueppert, President of Modeo, formerly known as Crown Castle Mobile Media.
The DTV1000 supports DVB-H operating at 470-750MHz (UHF) and 1.670-1.675GHz (L-band) frequency ranges, while the DTV1001 supports ISDB-T one-segment operating at 470-770MHz frequency range.
Through TI's innovative DRP technology, the Hollywood devices combine a two-chip or system in package (SIP) solution into a single piece of silicon in standard 90nm digital process to deliver: the smallest board area; very low power; fast time to market; high performance; and low parts count and lower bill of materials.
The high degree of integration and low ball count has lead to a footprint of less than 1cm2 for the entire solution including all passive and power switch components which is significantly smaller than current solutions that require a separate tuner, demodulator and external memory.
The low 1V RF CMOS process and low power design techniques have resulted in only 30mW of power consumption for a typical category B DVB-H terminal.
Combined with TI's low power OMAP application processors this can deliver four to seven hours of view time depending on display size and battery rating.
Significant value-added processing in the DTV100X results in a simple software driver and API package accelerating integration with host processors, such as OMAP applications processors, and reducing time to market.
Multiple concurrent television channels (elementary streams) can be supported and fast channel switching times under 1.5s are possible.
High integration has lead to a small number of low cost external components driving the estimated bill of materials in volume under $10.
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