Product category:
Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial
Team on 16 February 2006
Chipset to feature in Windows Mobile
smartphones
Amoi Electronics, HTC Corp and Sagem Communication are all developing new Windows Mobile-based smartphones leveraging TI's OMAPV1030 Edge chipset.
Amoi Electronics, HTC Corp and Sagem Communication are all developing new Windows Mobile-based smartphones leveraging TI's OMAPV1030 Edge chipset These phones will be based on a lower-cost, high-performance chipset architecture for Windows Mobile device makers, previously only available for feature phones
This article was originally published on Electronicstalk on 15 Feb 2005 at 8.00am (UK)
Related stories
Baseband processor migrates towards UMTS
An enhanced, cost-efficient GSM/GPRS/Edge solution for handset manufacturers aims to bring advanced multimedia features to mainstream mobile phones.
Data buffer has dual multiplexer
Texas Instruments has introduced the industry's first 0- to 4-Gbps data buffer/signal conditioner with a dual multiplexer.
Until now, many smartphones running on a high-level operating system such as Microsoft Windows Mobile necessitated a more expensive dual-core chipset to power the rich user interface, data networking and additional personal and business applications.
compared with previous multicore architectures, this single-core solution offers significant costs savings on the total bill of materials.
This has been achieved through higher levels of integration, more aggressive process technology and better system partitioning.
Further reading
Reference design for wireless optical comms
A new technology from Texas Instruments dramatically cuts the cost and complexity of bringing the high-speed datarates of optical networking to end users.
TI adds low-cost and high-integration DSP pair
Texas Instruments has unveiled the latest pair of programmable DSPs in its ultra-power-efficient TMS320C55x family of digital signal processors.
Microsoft leveraged TI's OMAPV1030 chipset with its own Windows Mobile software to enable smart device capabilities at feature phone costs, thereby spurring smartphone market growth.
Analysts suggest that an increasing number of companies prefer employees to have access to critical business information while outside of the office.
Driving down the costs of smart devices is critical to maximising this demand for increased sales and services.
Gartner predicts a huge rise over the next three years or so in the number of people using wireless e-mail.
By the end of 2006, there will be at least 16 million business and consumer users.
And, by the end of 2008, half of all employees who access e-mail via PCs will also have access to wireless e-mail.
"TI's integrated and optimised OMAPV1030 solution was designed to deliver enhanced features at a reduced cost", said Edgar Auslander, General Manager, Worldwide Strategy and Corporate Development, TI Wireless Business Unit.
"Combined with Windows Mobile software from Microsoft, the OMAPV1030 will enable handset manufacturers like Amoi, HTC and Sagem to bring advanced multimedia and productivity features to mainstream mobile phones".
"Our mobile operator partners are eager to expand their customer base with a diverse and affordable portfolio of Windows Mobile-based devices", said Scott Horn, General Manager, Mobile and Embedded Devices Division at Microsoft.
"Texas Instruments' innovative hardware platform, coupled with our software, will help device makers sell more smartphones to an increasing number of mobile workers who want to stay connected while away from the office".
Availability of these handsets is expected within 12 months.
• Texas Instruments (April 2001-March 2006): contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
