Product category:
Standard Logic Devices
News Release from: Texas Instruments (April 2001-March 2006) | Subject: FlatLinkTM3G
Edited by the Electronicstalk Editorial
Team on 06 March 2006
Interfaces upgrade handset video
A new family of interface integrated circuits provide true-colour high-resolution video content in handheld electronics.
Texas Instruments has a new family of interface integrated circuits for true-colour high-resolution video content in handheld electronics TI's new FlatLinkTM3G serialisers and deserialisers provide a high-speed interface between liquid crystal displays and mobile application processors such as TI's widely adopted OMAP platform
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The sub-LVDS (sub-low-voltage differential signalling) serialisers for mobile applications transmit true 24bit RGB colour data and support screen resolutions from QVGA to XGA, including VGA.
They enable sharper, more realistic video in clamshell phones, multimedia players and digital cameras.
"Consumers today can download TV shows to their mobile phones, but existing interface technology limits the display quality", said David Mulcahy, TI's High-Speed Interface Marketing Manager.
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"TI's FlatLinkTM3G family provides the bridge from processor to display panel that allows designers to take full advantage of newer, higher-resolution screens such as VGA and lets end users enjoy a palette of 16 million colours".
The high performance of the SN65LVDS301 transmitter supports current and future screen resolutions in mobile handset displays.
Designers are able to select one, two or all three of the device's serial sub-LVDS channels according to the design needs, allowing them to develop with the same chipset for resolutions from QVGA through XGA, including VGA.
Supporting signals of up to 150mV swing on the transmitter, the LVDS301 reduces 27bit of data down to one, two or three channels, depending on the application.
The low-swing serial signal helps reduce electromagnetic interference (EMI), which is a critical parameter in cellphones.
With a noise floor around -105dBm and spurs below -95dBm, the EMI of the LVDS301 is extremely low.
In addition, the serial transmitter requires fewer interconnects than typical parallel interfaces, allowing a much thinner flex cable to be used.
This allows for a more reliable and robust mechanical connection across the clamshell hinge and makes swivel screen designs easier.
The LVDS301 offers several features that make the designer's job easier, such as bus swap, which allows more flexibility in board layout and assembly.
In addition, the devices' parity check feature enables designers to catch errors while testing their design, which ensures accurate image display.
FlatLink3G devices are compatible with display modules and driver integrated circuits available from manufacturers such as Himax Technologies, Hitachi Displays, Renesas Technology LCDBU, Samsung SDI and Sanyo Epson Imaging Devices.
TI's FlatLink3G family joins the company's interface IC offering for telecommunications, consumer electronics, computing, industrial and automotive applications.
TI supports more standards, offers more products and is chosen four times more often than any other interface supplier.
The SN65LVDS301 transmitter IC is sampling now in a 5 x 5mm MicroStar Junior BGA package.
It will be available in volume in Q2 2006, priced at $2.10 in 1000-unit quantities.
Support for designers will include Ibis models.
TI will introduce the three-channel receiver, as well as one- and two-channel transmitters and receivers in the FlatLink3G family in Q3 2006.
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