Product category:
Intellectual Property Cores
News Release from: Tensilica
Edited by the Electronicstalk Editorial
Team on 09 February 2007
Tensilica audio/video processors at 3GSM
Congress
Tensilica will be showcasing mobile phones that use its audio and video processors at the 3GSM World Congress (Hall 2, Level 1, Booth 2.1A67) in Barcelona, Spain, February 12-15, 2007.
Tensilica will be showcasing mobile phones that use its audio and video processors at its booth at the 3GSM World Congress (Hall 2, Level 1, Booth 2.1A67) in Barcelona, Spain, February 12-15, 2007 Tensilica is a leading IP (intellectual property) supplier for mobile multimedia (audio and video) processor cores with its HiFi 2 Audio Engine, its Xtensa configurable processors, and its Diamond Standard VDO (video) family
This article was originally published on Electronicstalk on 30 Mar 2005 at 8.00am (UK)
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Tensilica will exhibit phones from Cingular, LG Electronics, Motorola, and Samsung that include Tensilica processor cores performing audio and video encoding and decoding.
"Tensilica is fast becoming the de facto standard processor core provider for mobile multimedia", stated Steve Roddy, Tensilica's vice president of marketing.
"Tens of millions of cell phones will ship this year with our HiFi 2 Audio Engine and Xtensa-based video processors".
Further reading
Optimised core jumps the queue to top benchmark
Tensilica has claimed the highest score ever reported on the Networking Version 2.0 benchmark suite of the Embedded Microprocessor Benchmark Consortium (EEMBC).
Core claims top performance at 90nm node
The Xtensa LX reaches the highest clock rate published to date of any licensable 32bit processor in 90nm technology.
Tensilica's processors are particularly appealing for mobile applications because they use less power, take up less silicon area, and have a broader base of software support than competing solutions.
Leading handset OEMs like LG Electronics and leading mobile handset semiconductor ASSP (application-specific standard product) providers such as AMD [ATI] and NVIDIA are currently shipping volume silicon into handset applications, and more designs are in the product pipeline.
Tensilica's HiFi 2 Audio Engine provides an energy-optimised approach to embedding multiple audio standards into system-on-chip (SoC) designs.
Its broad software base includes encoders and decoders for AM3D, Dolby Digital AC-3, Dolby Digital Plus, MP3, MPEG-2/4 AAC LC, MPEG-4 aacPlus v1 and v2, WMA, Ogg Vorbis, QSound microQ, SONiVOX AudioiNSIDE, AMR narrowband and wideband speech, and G.729AB speech.
More than a dozen new audio and speech codecs for the HiFi 2 Audio Engine are expected to be released by Tensilica and its partners in 2007.
Tensilica's customers in the mobile handset segment are using its Xtensa configurable and Diamond Standard processors for SOC control functions as well as video processing.
Because the datapath in an Xtensa processor can be optimised to exactly match the video stream being processed, it can be used to create a multi-standard video engine that can keep up with the most demanding applications.
Tensilica will also demonstrate its recently introduced Diamond Standard 38X VDO family of video processors.
These are fully programmable to support all popular standard definition (SD, also known as D1) video codecs with resolutions up to 720x480 (NTSC) and 720x576 (PAL), including H.264 Main Profile, VC-1 Main Profile, MPEG_4 Advanced Simple Profile (ASP), and MPEG-2 Main Profile, each of which is available from Tensilica.
Lower resolutions, such as QCIF, QVGA, CIF, and VGA, are also supported.
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