Product category:
Intellectual Property Cores
News Release from: Tensilica
Edited by the Electronicstalk Editorial
Team on 15 February 2008
Samsung signs for audio DSP core
Samsung will use the Diamond Standard 330HiFi audio DSP in mobile handset and other designs.
Samsung Electronics has signed a broad multi-year licence for Tensilica's Diamond Standard 330HiFi audio DSP Tensilica's HiFi architecture is the most popular commercial audio core for SoC designs
This article was originally published on Electronicstalk on 30 Mar 2005 at 8.00am (UK)
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Samsung will use the Diamond Standard 330HiFi audio DSP in mobile handset and other designs.
"Tensilica's HiFi 2 audio DSP architecture is a widely adopted, advanced DSP core with over 30 voice and audio encoder and decoder software packages readily available", says GS Han, Vice President of Samsung Electronics, System LSI Division.
"After a thorough technical evaluation of Tensilica's HiFi offering, we found that the Diamond 330HiFi was the right audio DSP for Samsung and will be a key DSP in our IP portfolio for years to come".
"We are very pleased that Samsung, a key player in the mobile phone chipset market, has selected the Diamond Standard 330HiFi audio DSP", says Chris Rowen, Tensilica's President and CEO.
"This validates the growing momentum for the HiFi 2 Audio Engine architecture as the de facto industry standard IP offering for high-fidelity ultra-low-power audio".
The Diamond Standard 330HiFi is a processor core that includes the HiFi 2 Audio Engine, which has been optimised to efficiently run over 30 different audio software packages.
This processor can encode and decode multiple audio standards to meet the needs of today's ever evolving consumer audio products ranging from cellular phone handsets to home entertainment systems.
Supported audio packages include: Dolby Digital AC-3 and Dolby Digital Plus, MP3, MPEG-2/4 AAC LC, MPEG-4 aacPlus V1 and V2, Ogg Vorbis, WMA, AMR, G.729AB speech, AM3D, QSound, Sonivox, EAS, and SRS.
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