Product category:
VMEbus Boards and Assemblies
News Release from: Thales Computers
Edited by the Electronicstalk Editorial
Team on 19 January 2007
Demo accelerates existing VME
infrastructure
Thales and the 3M Electronics unit have developed a breakthrough upgrade solution for VITA 1.1 applications using the 2mm hard metric P0 connector present in most existing VME systems.
Thales and the 3M Electronics unit have developed a breakthrough upgrade solution for VITA 1.1 applications using the 2mm hard metric P0 connector present in most existing VME systems Thales presented the solution during the Bus and Boards event, an implementation of the PCI Express high-speed interconnection between 6U VME boards
This article was originally published on Electronicstalk on 28 Jun 2002 at 8.00am (UK)
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Using a highly flexible and modular high speed connector technology from 3M Electronics - the high speed hard metric (HSHM) implemented on computer boards - Thales Computers can now offer what was once considered as impossible: a multigigabit per second interconnection solution compatible with the existing VME infrastructure.
"Once again the VME ecosystem demonstrated its extraordinary vitality by achieving major technology improvements while retaining backwards compatibility", said Robert Negre, Chief Technical Officer of Thales Computers.
"We have been working on this for quite some time now and have mastered end-to-end solutions for both RapidIO and PCI Express interconnects on the current VME64x backplane".
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"This becomes a big asset in situations where switching to newer connector technology in the system is not an option".
Thales Computers is already selling this technology on the PENTXM2, the first dual-core Intel VME single board computer available on the market, and the V2PMC2, a mechanically independent VME blade mezzanine carrier featuring dual PCI-X PMC slots.
The use of a 4x PCI Express data link through P0 between the computer board and the carrier significantly expands the I/O throughput capabilities of systems using demanding I/O traffic from high-end COTS mezzanine such as FPGA or high performance network controllers.
As for the PowerPC domain, the PowerNode5 dual PPC970 computing board also uses this connector technology and a special onboard distributed RapidIO switch to implement a full mesh scalable interconnect solution on classical backplane.
The breakthrough is achieved by using 3M's HSHM receptacle connector in a B19 configuration.
HSHM is a highly flexible and modular, 5Gbit/s connector system, with a industry standard 2mm hard metric format in accordance with the IEC61076-4-101 connector standard.
The HSHM connectors use "virtual coaxial shielding" technology to provide maximum performance with minimal cross talk and skew.
This allows the HSHM to plug into existing hard metric P0 connectors and support speeds necessary to achieve PCI Express or RapidIO protocols.
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