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Product category: Antennas and Feeders
News Release from: Thunderline Z | Subject: Multitermination packages
Edited by the Electronicstalk Editorial Team on 26 November 2002

Complex packaging speeds assembly
processes

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Thunderline-Z has developed an advanced process for producing premium multitermination packages.

To satisfy the needs of component and subsystem manufacturers required to adhere to repeatable soldering schedules in multitermination packages, Thunderline-Z has developed an advanced process for producing premium packages The process uses advanced furnace profiling techniques combined with a variety of solder materials and soldering techniques

The result is the ability to quickly deliver packages with any combination and number of the following termination types: capacitive feedthroughs; GPOTM/GPPOTM connectors; RF and DC feedthroughs; HF probes; and grounding pins.

Frequencies up to 65GHz are achievable with hermeticity being offered at up to 1 x 10-9.

Thunderline-Z has developed this advancement in soldered assembly packaging in response to the requirements of component and subsystem manufacturers needing to include everything from grounding planes to 65GHz terminations in a single package.

Prior to this development engineers were left to cope with ways to ensure high temperature sealing while maintaining low temperature soldering on their own.

This was previously accomplished by independently addressing each termination, sometimes with a hot plate, or numerous and costly passes through a furnace and then into and out of test departments.

In addition to the inherent labour costs, this practice proved difficult to work with on the component installation end, as the consistency of the process was difficult to repeat.

Thunderline-Z's advanced packages are ideal for circuit designers in the RF, microwave, medical, and telecomms industries requiring repeatable, high-performance seals and connections in their multitermination packages.

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