Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Tower Semiconductor
Edited by the Electronicstalk Editorial
Team on 04 August 2006
SanDisk signs for wafer expansion
Tower Semiconductor has signed a memorandum of understanding with SanDisk Corp to invest in the expansion of its 0.13um logic wafer capacity.
Tower Semiconductor has signed a memorandum of understanding with SanDisk Corp to invest in the expansion of its 0.13um logic wafer capacity SanDisk has committed to purchase volume production quantities of 0.13um wafers during 2007 and 2008 and will have right of first refusal on the use of this extra capacity in 2009
This article was originally published on Electronicstalk on 25 Nov 2005 at 8.00am (UK)
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"SanDisk continues to execute on an aggressive technology roadmap which has moved a large volume of our controller products to 0.13um technology", said Dr Randhir Thakur, Executive Vice President of Technology and Worldwide Operations, SanDisk Corporation.
"We have a long-standing business relationship with Tower, based upon Tower's best of class responsiveness to our business needs through design services, process knowhow and operational flexibility".
"We are pleased to work with Tower to help secure supply of our controllers in the 0.13um process".
"Being t he world wide leader in Flash storage card products, it is a great vote of confidence from SanDisk to both help finance the 0.13um capacity expansion and to commit to the consumption of it".
"We have begun manufacturing our first SanDisk products in this advanced node and have achieved quite reasonable die yields", said Russell Ellwanger, Tower CEO.
"We are thrilled to have entered into an agreement with SanDisk which ensures the continuation of our long-term partnership".
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