Product category:
Electronics Manufacturing Services
News Release from: Tower Semiconductor
Edited by the Electronicstalk Editorial
Team on 13 April 2007
Power amplifier booster runs on RF-CMOS
process
Tower Semiconductor has begun manufacturing the XNN power amplifier (PA) booster for Paragon Communications.
Tower Semiconductor has begun manufacturing the XNN power amplifier (PA) booster for Paragon Communications This innovative product is based on Paragon's patented technology to monitor the radio frequency (RF) envelope and modulate the amplification
This article was originally published on Electronicstalk on 25 Nov 2005 at 8.00am (UK)
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The XNN PA booster chip will be manufactured on Tower's 0.18um process, including its RF-CMOS feature, at Tower's FAB2 facility.
"With Tower's state-of-the-art RF-CMOS process and invaluable technical support including design services, we were able to attain outstanding performance enhancements to Wi-Fi and WiMax PAs of up to 6dB in output power, 50% in efficiency and heat dissipation, while maintaining the same linearity criteria of the PA", said Zeev Cohen, VP R and D, Paragon.
"We have proven on silicon, by using complex test chip, that our concept works and our product will attain the performance targets".
"Tower has provided a one-stop shop in terms of capabilities from design to manufacturing".
"Tower's teams assisted in taking the Paragon concept from patent to silicon reality through Tower Design services group and RF specialists".
"We are very pleased with our partnership with Tower and look forward to a long-term business relationship".
"The Wi-Fi market is exploding and with the new 802.11n MIMO based standard it is expected to grow exponentially over the next 4 to 5 years", commented Eli Plotnik, CEO, Paragon.
"This market, together with the emerging WiMAX and next generation Cellular LTE markets, positions Paragon with the high quality XNN PA booster chip that will be manufactured at Tower, as a market leader in this field".
"We are pleased that Paragon made effective use of our RF-CMOS capabilities".
"Our technology helps in enabling the XNN functionality, performance and chip-level integration thereby facilitating attainment of the product goals", said Yossi Netzer, General Manager, RF and Mixed Signal product line, Tower.
"Paragon is an example of a dynamic young company that benefits from the close co-operation with Tower's design and manufacturing teams, thereby yielding excellent technical results and setting the foundations for business success".
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