Product category:
Power Supply ICs and Controllers
News Release from: Toshiba Electronics Europe | Subject: TB62209F
Edited by the Electronicstalk Editorial
Team on 30 March 2001
All-in-one low-noise stepper motor
driver IC
Toshiba has introduced a high-precision motor driver IC that uses BiCD semiconductor technology to integrate bipolar and CMOS devices with high-voltage DMOS power MOSFETs in a single chip.
Toshiba has introduced a high-precision motor driver IC that uses BiCD semiconductor technology to integrate bipolar and CMOS devices with high-voltage double-diffused MOS (DMOS) power mosfets in a single chip The new TB62209 motor driver IC is designed to simplify the implementation of low-noise stepping motor control designs in industrial applications and office equipment such as printers and fax machines
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The TB62209F stepping motor driver IC uses Toshiba's BiCD process to integrate motor control with high-voltage power mosfets.
These mosfets have a maximum voltage rating of 40V and an on resistance that, at just 0.5ohm, delivers power consumption up to three times less than traditional bipolar motor drive ICs.
The acoustic noise and vibration of stepping motor applications reduces as the micro-step input current waveform becomes closer to that of a sine wave.
Conventional micro-step motor driver ICs use a separate microprocessor to process input data and produce the 'pseudo' sinewave needed for smooth, low vibration motor control.
The TB62209F IC eliminates the need for this microprocessor through an internal, high-precision 4bit decoder that automatically generates a smooth, micro-step waveform from the applied clock input signal.
The new IC integrates Toshiba's proprietary Selectable Mixed Decay Mode (SMDM) technology which accurately controls current decay and varies the motor drive input signal depending on the motor's load and speed.
Four decay modes ensure low-vibration, high-accuracy control that remains optimised across a wide variety of operating conditions.
Toshiba's TB62209F is designed to minimise board space and is housed in a 36-pin heatsink small outline package (HSOP).
The device combines overtemperature and overcurrent protection with power supply monitoring functionality and indicates potential problems via a warning output pin.
Samples of the TB62209F will be available from 1st May 2001, and mass production will start in June.
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