Compact modules deliver reduced component count

A Toshiba Electronics Europe product story

Edited by the Electronicstalk editorial team Jun 21, 2001

Toshiba claims its latest compact intelligent power modules will save space, reduce component count and improve reliability in high-power switching designs requiring operation up to 1200V.

Combining improved performance with high levels of built-in protection, the latest compact intelligent power modules from Toshiba will save space, reduce component count and improve reliability in high-power switching designs requiring operation up to 1200V.

Toshiba's new 600 and 1200V C-IPM compact intelligent power modules are ideal for replacing discrete solutions in applications such as general-purpose inverters and motor drives.

High levels of integration lead to significantly simplified designs, with a power supply and photocouplers being the only additional components required to implement a fully operational system.

In addition, a dedicated socket design that eliminates the need for solder connections reduces assembly time, prevents incorrect connection and improves system reliability.

The 600V and 1200V C-IPM modules are available with current rating options of 50, 75, 100, 150, 200, 300 or 400A, with the 600V devices also offering a 600A version.

All the modules incorporate high levels of integrated intelligence, including control supply undervoltage protection for the gate drive and protection against short circuit, overcurrent and overtemperature conditions.

Circuitry for high-side and low-side fault output indication is also incorporated into each device.

Supplied in package sizes down to just 107 x 55 x 22mm, the new power modules are available with a variety of configurations including six pack and half bridge versions.

Brake chopper functionality is offered on 50, 75, 100 and 150A devices in the 600V line-up and on the 50 and 75A modules in the 1200V range.

Toshiba has been able to improve performance and minimise module size by combing a low-loss IGBT design with improved thermal management techniques and new gate control circuitry that further improves efficiency levels.

The gate control circuitry, along with a new soft recovery diode technology, also helps to reduce noise for improved EMC performance.

The 600V modules are based on Toshiba's high-efficiency trench gate technology, whereas the 1200V modules use the latest version of the company's raw thin-wafer NPT technology.