Lead-free MOSFETs keep their heads down onboard

A new lead-free power MOSFET package offers full pin compatibility with existing TO-220 devices, while delivering a 13.5% reduction in PCB mounting height and significantly faster switching speeds.

A new lead-free (Pb-free) power mosfet package developed by Toshiba offers full pin compatibility with existing TO-220 devices, while delivering a 13.5% reduction in PCB mounting height and a significant increase in switching speeds.

Designed to save space and improve performance in high-speed applications such as switching regulators, the new TO-220 Smart Isolation (TO-220SIS) package PCB mounting height is 2.8mm shorter than previous TO-220NIS packages.

A 10% reduction in turn off time compared to previously available devices contributes to the increased switching speeds.

Toshiba has been able to provide the improvements through an optimised chip design that improves thermal performance and minimises mosfet gate charge.

The former has allowed the pin shape to be modified such that the 'stand off' from the circuit board is reduced from 5.6 to 2.8mm.

Gate charge is a significant factor in switching speeds and by lowering it by up to 10% turn-off times are significantly reduced.

Toshiba is now offering power mosfets in the new TO-220SIS style for new designs or for direct replacement of previous package styles in existing applications.

Voltage ratings range from 500 to 900V, and current ratings are between 2 and 10A.

Maximum on resistance on-resistance values are as low as 0.51ohm depending on the device chosen.

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