Diode packages claim big PCB savings

New PIN and varicap diodes use miniature, lead-free packages that can reduce board mounting area by 67% and board mounting height by 38% when compared with the smallest package previously available.

The new JDP2S08SC PIN diode and JDV2S22SC varicap diode use miniature, lead-free packages that can reduce board mounting area by 67% and board mounting height by 38% when compared with the smallest package previously available.

Developed for use in mobile phones and other miniature portable devices, the new diodes use Toshiba's SC2 package that measures just 0.62 x 0.32 x 0.30mm.

This makes the new devices similar in size to an 0603 type passive chip component, and smaller than the previous smallest package from Toshiba (the fSC with dimensions of 1.0 x 0.6 x 0.48mm).

The JDP2S08SC PIN diode is suitable for use as an antenna switch, whereas the JDV2S22SC varicap diode can be used in VCO applications.

Both devices are suited to high-density component mounting and feature a bottom-surface lead type.

The miniaturisation of the diodes ensures that they have high-frequency characteristics that are equivalent to or better than existing package products.

Toshiba will expand its line-up of lead-free, SC2-packaged products in the future with additional miniature components designed to address market needs.

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