Product category:
Optoelectronic Sensors, Switches and Receivers
News Release from: Toshiba Electronics Europe | Subject: ET8EE6-AS and ET8EF2-AS
Edited by the Electronicstalk Editorial
Team on 18 October 2006
Shrinking sensors maintain handset
resolution
CMOS image sensors enable development of smaller, space-saving camera modules for cellular phones and other camera-enabled mobile devices.
Toshiba Electronics Europe (TEE) has announced the further expansion of its industry-leading Dynastron CMOS image sensor product line with the addition of two new chips: the 3.2Mpixel ET8EE6-AS CMOS image sensor and 2.0Mpixel ET8EF2-AS CMOS image sensor SoC with integrated image-signal processor (ISP) With a pixel pitch of just 2.2um, a significant advance in cell-size miniaturisation compared with the 2.7um pixel pitch of previous 2 and 3.2Mpixel products, the new devices enable development of smaller, space-saving camera modules for cellular phones and other camera-enabled mobile devices
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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Toshiba engineers were able to reduce the pixel pitch in both image sensors from 2.7 to 2.2um while retaining a pixel size capable of recording high-resolution images.
With the ET8EE6-AS, Toshiba reduced a 3.2Mpixel image sensor to a 1/3.2 optical format, an improvement over the company's previous 1/2.6in format size.
ET8EF2-AS achieves a 2.0Mpixel count in a quarter-inch optical format.
The new sensors also offer low-power consumption, smearless imaging and high-speed operation, all essential requirements for personal mobile equipment, including camera phones and personal media centres.
(A smear is a vertical stripe in an image and can occur in bright-light conditions, such as direct sunlight).
The ET8EF2-AS also integrates an ISP for sophisticated picture effects and advanced camera operations, such as digital zoom, windowing, image downsizing and picture flip.
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